XC2VP70 Xilinx, Inc., XC2VP70 Datasheet

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XC2VP70

Manufacturer Part Number
XC2VP70
Description
Virtex-ii Pro Field Programmable Gate Array
Manufacturer
Xilinx, Inc.
Datasheet

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DS083 November 11, 2003
This document includes all four modules of the Virtex-II Pro Platform FPGA data sheet.
Module 1:
Introduction and Overview
DS083-1 (v2.4.2) August 25, 2003
8 pages
Module 2:
Functional Description
DS083-2 (v2.9) October 14, 2003
48 pages
IMPORTANT NOTE: The Virtex-II Pro Platform FPGA data sheet is created and published in separate modules. This
complete version is provided for easy downloading and searching of the complete document. Page, figure, and table
numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks"
pane for easy navigation in this volume.
DS083 November 11, 2003
Advance Product Specification
Summary of Features
General Description
Architecture
IP Core and Reference Support
Device/Package Combinations and Maximum I/O
Ordering Information
Functional Description: RocketIO™ Multi-Gigabit
Transceiver
Functional Description: Processor Block
Functional Description: PowerPC™ 405 Core
Functional Description: FPGA
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© 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
Input/Output Blocks (IOBs)
Digitally Controlled Impedance (DCI)
On-Chip Differential Termination
Configurable Logic Blocks (CLBs)
3-State Buffers
CLB/Slice Configurations
18-Kb Block SelectRAM™ Resources
18-Bit x 18-Bit Multipliers
Global Clock Multiplexer Buffers
Digital Clock Manager (DCM)
Routing
Configuration
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
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www.xilinx.com
1-800-255-7778
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Advance Product Specification
Virtex-II Pro™ Platform FPGAs:
Complete Data Sheet
Module 3:
DC and Switching Characteristics
DS083-3 (v2.12) November 11, 2003
54 pages
Module 4:
Pinout Information
DS083-4 (v2.5.5) August 25, 2003
298 pages
Electrical Characteristics
Performance Characteristics
Switching Characteristics
Pin-to-Pin Output Parameter Guidelines
Pin-to-Pin Input Parameter Guidelines
DCM Timing Parameters
Pin Definitions
Pinout Tables
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FG256 Wire-Bond Fine-Pitch BGA Package
FG456 Wire-Bond Fine-Pitch BGA Package
FG676 Wire-Bond Fine-Pitch BGA Package
FF672 Flip-Chip Fine-Pitch BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FF1148 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
FF1696 Flip-Chip Fine-Pitch BGA Package
FF1704 Flip-Chip Fine-Pitch BGA Package

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