XC2VP20-6FF1152C Xilinx, Inc., XC2VP20-6FF1152C Datasheet - Page 94

• Manufacturer Part Number: XC2VP20-6FF1152C
• Description: Pro Platform FPGA
• Manufacturer: Xilinx, Inc.

Virtex-II Pro™ Platform FPGAs: Pinout Information
Table 4
Table 4: 3.3V SelectI/O Banks
Virtex-II Pro Pin Definitions
This section describes the pinouts for Virtex-II Pro devices
in the following packages:
•
•
•
All of the devices supported in a particular package are
pinout compatible and are listed in the same table (one
Module 4 of 4
94
Virtex-II Pro
Device
FG256 and FG456: wire-bond fine-pitch BGA of
1.00 mm pitch
FF672, FF896, FF1152, and FF1517: flip-chip
fine-pitch BGA of 1.00 mm pitch
BF957: flip-chip BGA of 1.27 mm pitch
2VP20
2VP50
2VP2
2VP4
2VP7
shows the number of 3.3V SelectI/Os in each bank and the total for each device/package combination.
Package
FF1152
FF1152
FF1517
FG256
FG456
FG256
FG456
FG456
BF957
BF957
FF672
FF672
FF672
FF896
FF896
Bank0
57
57
59
69
81
Bank1
17
21
27
17
21
27
21
39
39
57
55
57
59
69
81
Bank2
18
18
24
17
40
60
40
60
60
84
www.xilinx.com
1-800-255-7778
Bank3
18
18
24
17
42
60
42
60
60
table per package). Pins that are not available for the small-
est devices are listed in right-hand columns.
Each device is split into eight I/O banks to allow for flexibility
in the choice of I/O standards (see the Virtex-II Pro Data
Sheet). Global pins, including JTAG, configuration, and
power/ground pins, are listed at the end of each table.
Table 5
All Virtex-II Pro pinout tables are available on the distribu-
tion CD-ROM, or on the web (at
Bank4
provides definitions for all pin types.
Bank5
Bank6
DS083-4 (v1.0) January 31, 2002
Advance Product Specification
http://www.xilinx.com
Bank7
3.3V I/Os
Total
103
147
103
159
159
114
139
114
118
138
162
53
57
75
51
).
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