XC2VP20-6FF1152C Xilinx, Inc., XC2VP20-6FF1152C Datasheet - Page 6

• Manufacturer Part Number: XC2VP20-6FF1152C
• Description: Pro Platform FPGA
• Manufacturer: Xilinx, Inc.

IP Core and Reference Support
IP Core and Reference Support
Intellectual Property is part of the Platform FPGA solution.
In addition to the existing FPGA fabric cores, the list below
shows some of the currently available hardware and soft-
ware intellectual properties
Virtex-II Pro by Xilinx. Each IP core is modular, portable,
Real-Time Operating System (RTOS) independent, and
CoreConnect compatible for ease of design migration.
Refer to
list of cores.
Hardware Cores
•
Virtex-II Pro Device/Package Combinations and Maximum I/Os
Offerings include ball grid array (BGA) packages with
1.0 mm pitch. In addition to traditional wire-bond intercon-
nects, flip-chip interconnect is used in some of the BGA
offerings. The use of flip-chip interconnect offers more I/Os
than are possible in wire-bond versions of the similar pack-
ages. Flip-chip construction offers the combination of high
pin count and excellent power dissipation.
Table 3: Virtex-II Pro Device/Package Combinations and Maximum Number of Available I/Os
(Advance Information)
6
Package
FF1152
FF1517
Bus Infrastructure cores (arbiters, bridges, and more)
FG256
FG456
BF957
FF672
FF896
www.xilinx.com
Pitch (mm)
1.00
1.00
1.00
1.00
1.00
1.00
1.27
for the latest and most complete
specially developed for
Size (mm)
17 x 17
23 x 23
27 x 27
31 x 31
35 x 35
40 x 40
40 x 40
XC2VP2
140
156
204
www.xilinx.com
1-800-255-7778
•
•
•
Software Cores
•
•
•
•
•
•
The
(Table
device and package using wire-bond or flip-chip technology.
•
•
•
XC2VP4
140
248
348
Memory cores (Flash, SRAM, and more)
Peripheral cores (UART, IIC, and more)
Networking cores (ATM, Ethernet, and more)
Boot code
Test code
Device drivers
Protocol stacks
RTOS integration
Customized board support package
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
BF denotes flip-chip fine-ptich BGA (1.27 mm pitch).
Virtex-II Pro
3) details the maximum number of I/Os for each
User Available I/Os
XC2VP7
248
396
396
device/package
DS083-1 (v1.0) January 31, 2002
Advance Product Specification
XC2VP20
556
564
564
combination
XC2VP50
692
852
584
table
R