HFC-Smini Cologne Chip AG, HFC-Smini Datasheet - Page 59

• Manufacturer Part Number: HFC-Smini
• Manufacturer: Cologne Chip AG

863 C ]Y^Y
7
7.1
In order to comply to the physical requirements of ITU-T recommendation I.430 and considering the
national requirements concerning overvoltage protection and electromagnetic compatibility (EMC), the
HFC-S mini needs some additional circuitry, which are shown in the following figures.
7.1.1 External receiver circuitry
Figure 10: External receiver circuitry
WAKE_UP_1 and WAKE_UP_2 are for connection of the wake up circuitry (see: 7.1.2 External wake-
up circuitry).
C15 and C16 are for reduction of high frequency input noise and should be placed as close as possible to
the HFC-S mini.
Part list
VDD
C15
C16
C18
D2
D1
ISDN_ST1
RA2
RA1
RB1
RB2
A D J _ L E V
L E V _ R 1
L E V _ R 2
R 1
R 2
External circuitries
S/T interface circuitry
3.3V
C 1 5
C 1 6
G N D
22pF
22pF
47nF
BAV99
BAV99
ISDN Connector
100k
100k
33k
33k
R 2 0
R A 1
R A 2
5V
R C 1
R C 2
R B 1
R B 2
R 1 5
V D D
D 2
D 1
R D 1
R D 2
VDD
RD1
RC1
RD2
RC2
R14
R15
R20
TR1A
G N D
W A K E _ U P _ 1
W A K E _ U P _ 2
G N D
3.3V
680k
1M2
S/T Module (see Table 4 on
page 63)
C 1 8
4k7
4k7
4k7
4k7
3k9
R 1 4
TR 1 A
R E C
5V
1M
1M8
V D D
Cologne
Chip
I S D N _ S T1
R E C 1
R E C 2
TR A N S 1
TR A N S 2