SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 609

• Manufacturer Part Number: SAM9G45
• Manufacturer: Atmel Corporation

Specifications of SAM9G45

• Flash (kbytes): 0 Kbytes
• Pin Count: 324
• Max. Operating Frequency: 400 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 160
• Ext Interrupts: 160
• Usb Transceiver: 3
• Usb Speed: Hi-Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 2
• Uart: 5
• Lin: 4
• Ssc: 2
• Ethernet: 1
• Sd / Emmc: 2
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: Yes
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 440
• Resistive Touch Screen: Yes
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 64
• Self Program Memory: NO
• External Bus Interface: 2
• Dram Memory: DDR2/LPDDR, SDRAM/LPSDR
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 0.9 to 1.1
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

34.4
34.5
Table 34-1.
Notes:
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
Pin Name
MCCDA
MCCK
MCDA0 - MCDA3
Application Block Diagram
Pin Name List
1. I: Input, O: Output, PP: Push/Pull, OD: Open Drain.
2. When several HSMCI (x HSMCI) are embedded in a product, MCCK refers to HSMCIx_CK, MCCDA to HSMCIx_CDA,
(2)
MCDAy to HSMCIx_DAy.
I/O Lines Description for 4-bit Configuration
Figure 34-2. Application Block Diagram
Pin Description
Command/response
Clock
Data 0..3 of Slot A
9 1011
1
2 3 4 5 6
ex: File System, Audio, Security, etc.
MMC
1213 8
Type
I/O/PP/OD
I/O
I/O/PP
Application Layer
7
HSMCI Interface
Physical Layer
(1)
9
1
2 3 4 5 6
Comments
CMD of an MMC or SDCard/SDIO
CLK of an MMC or SD Card/SDIO
DAT[0..3] of an MMC
DAT[0..3] of an SD Card/SDIO
SDCard
7 8
SAM9G35
SAM9G35
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