TE28F800B3B110 Intel, TE28F800B3B110 Datasheet - Page 6

• Manufacturer Part Number: TE28F800B3B110
• Manufacturer: Intel

Specifications of TE28F800B3B110

• Lead Free Status / Rohs Status: Not Compliant

28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
18 Aug 2005
6
Revision
Number
-007
-008
-009
-010
-011
-012
-013
-014
-015
-016
-017
-018
-019
-020
Corrected RP# pin description in Table 2, 3 Volt Advanced Boot Block Pin Descriptions
Corrected typographical error fixed in Ordering Information
4-Mbit packaging and addressing information corrected throughout document
Corrected 4-Mbit memory addressing tables in Appendices D and E
Max I
V
Added 64-Mbit density and faster speed offerings
Removed access time vs. capacitance load curve
Changed references of 32Mbit 80ns devices to 70ns devices to reflect the faster product
offering.
Changed VccMax=3.3V reference to indicate the affected product is the 0.25µm 32Mbit
device.
Minor text edits throughout document.
Added New Pin-1 indicator information on 40 and 48Lead TSOP packages.
Minor text edits throughout document.
Added specifications for 0.13 micron product offerings throughout document
Minor text edits throughout document.
Adjusted ordering information.
Adjusted specifications for 0.13 micron product offerings.
Revised and corrected DC Characteristics Table.
Adjusted package diagram information.
Minor text edits throughout document.
Updated ordering information.
Adjusted specifications for 0.13 micron product offerings.
Updated AC/DC Characteristics Table.
Added TSOP and µBGA* package diagram information.
Minor text edits throughout document.
Updated the layout of the datasheet.
Added line items to
Removed all x8 products from ordering information, page 70
CC
Max on 32 M (28F320B3) changed to 3.3 V
CCD
changed to 25 µA
Intel
Table 34 “Ordering Information: Valid Combinations” on page
®
Order Number: 290580, Revision: 020
Advanced Boot Block Flash Memory (B3)
Description
70.
Datasheet