TE28F800B3B110 Intel, TE28F800B3B110 Datasheet - Page 29

• Manufacturer Part Number: TE28F800B3B110
• Manufacturer: Intel

Specifications of TE28F800B3B110

• Lead Free Status / Rohs Status: Not Compliant

Table 9.
Figure 8.
Datasheet
Ext. Temp. 64
Mbit
Ext. Temp. 32
Mbit
Ext. Temp. 16
Mbit
Ext. Temp. 8
Mbit
B3 Flash Memory Device Ordering Information
x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down)
Notes:
1.
TE28F016B3TA90
TE28F016B3TA110
TE28F008B3TA90
TE28F008B3TA110
C
D
A
B
E
F
A19 and A20 indicate the upgrade address connections. Lower density devices do not have the upper
address solder balls. Do not route is not done in this area. A
device.
40-Lead TSOP
GND
V
A14
A15
A16
A17
Intel
1
CCQ
®
Order Number: 290580, Revision: 020
Advanced Boot Block Flash Memory (B3)
Ordering Information Valid Combinations
A12
A10
A13
NC
A11
D7
2
TE28F016B3BA90
TE28F016B3BA110
TE28F008B3BA90
TE28F008B3BA110
WE#
NC
A8
A9
D5
D6
3
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
RP#
V
NC
NC
D4
4
PP
8M
TE28F640B3TC70
TE28F320B3TD70
TE28F320B3TC70
TE28F320B3TC90
TE28F320B3TA100
TE28F320B3TA110
TE28F160B3TC70
TE28F160B3TC80
TE28F160B3TA90
TE28F160B3TA110
TE28F800B3TA90
TE28F800B3TA110
W P#
V
A19
D2
D3
5
CC
16M
20
is the upgrade address for the 16-Mbit
NC
NC
NC
A20
A18
A6
6
48-Lead TSOP
CE#
D0
D1
A7
A5
A3
7
TE28F640B3BC70
TE28F320B3BD70
TE28F320B3BC70
TE28F320B3BC90
TE28F320B3BA100
TE28F320B3BA110
TE28F160B3BC70
TE28F160B3BC80
TE28F160B3BA90
TE28F160B3BA110
TE28F800B3BA90
TE28F800B3BA110
GND
OE#
8
A4
A2
A1
A0
18 Aug 2005
29