VSC8211XVW Vitesse Semiconductor Corp, VSC8211XVW Datasheet - Page 135

• Manufacturer Part Number: VSC8211XVW
• Description: IC PHY 10/100/1000 SGL 117-LBGA
• Manufacturer: Vitesse Semiconductor Corp
• Type: PHY Transceiverr

Specifications of VSC8211XVW

• Number Of Drivers/receivers: 1/1
• Protocol: Gigabit Ethernet
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Package / Case: 117-LBGA
• Case: BGA
• Dc: 07+
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 907-1023

26.3 Thermal Application Data
26.4 Package Thermal Specifications - 117 LBGA
VMDS-10105 Revision 4.1
October 2006
Printed Circuit Board Conditions (JEDEC JESD51-9)
PCB Layers
PCB Dimensions (mm x mm)
PCB Thickness (mm)
Environment Conditions
Maximum operation junction temperature (ºC)
Ambient free-air operating temperature (ºC)
Worst Case Power Dissipation (W)
θ
θ
θ
JA
JA
JA
Symbol
Symbol
(0 m/s air-
(1 m/s air-
(2 m/s air-
flow)
flow)
flow)
Ψ
θ
θ
T
T
JC
JB
A
J
JT
Min
Min
Table 41. Thermal Specifications - 117 ball LBGA 10x14mm package
15.0
0.21
23.0
37.7
32.5
31.1
Typ
125
Typ
70
Table 39. PCB and Environmental Conditions
Table 40. Thermal Resistance Data
Max
Max
135 of 165
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
°C
°C
4
101.6 x114.3
1.6
125
70
1
Junction-to-ambient thermal resistance
Junction-to-ambient thermal resistance
Junction-to-ambient thermal resistance
Ambient free-air operating temperature
Maximum operating junction temperature
Junction-to-case thermal resistance
Junction-to-top center of case thermal
resistance
Junction-to-board thermal resistance
Parameter Description & Conditions
Parameter Description & Conditions
Datasheet
VSC8211