MCP2510-I/SO Microchip Technology, MCP2510-I/SO Datasheet - Page 67

IC CAN CONTRLER IND TEMP 18SOIC

MCP2510-I/SO

Manufacturer Part Number
MCP2510-I/SO
Description
IC CAN CONTRLER IND TEMP 18SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP2510-I/SO

Package / Case
18-SOIC (7.5mm Width)
Controller Type
CAN Interface
Interface
SPI
Voltage - Supply
3 V ~ 5.5 V
Current - Supply
10mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Product
Controller Area Network (CAN)
Number Of Transceivers
1
Data Rate
5 Mbps
Supply Voltage (max)
5.5 V
Supply Voltage (min)
3 V
Supply Current (max)
10 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV251001 - KIT DEVELOPMENT CAN MCP2510
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP2510-I/SO
Quantity:
5 510
Part Number:
MCP2510-I/SO
Manufacturer:
MICROCHIP
Quantity:
8 000
Part Number:
MCP2510-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
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Part Number:
MCP2510-I/SO
Quantity:
84
© 2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
α
E1
A2
E
Units
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
φ
MIN
2.05
0.10
0.25
0.40
0.20
0.31
L
h
L1
MILLMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
Microchip Technology Drawing C04-051B
h
β
MAX
2.65
0.30
0.75
1.27
0.51
0.33
15°
15°
MCP2510
DS21291F-page 67
c

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