MPC8544VTALF Freescale Semiconductor, MPC8544VTALF Datasheet - Page 24

• Manufacturer Part Number: MPC8544VTALF
• Description: MPU POWERQUICC III 783-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8544VTALF

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 667MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 783-FCPBGA
• Processor Series: MPC85xx
• Core: e500
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 667 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 1.8 V, 3.3 V
• Interface Type: I2C, HSSI, DUART
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Enhanced Three-Speed Ethernet (eTSEC), MII Management
characteristics for MDIO and MDC are specified in
Characteristics.”
8.2
All GMII, MII, TBI, RGMII, RTBI, RMII, and FIFO drivers and receivers comply with the DC parametric
attributes specified in
RMII, and FIFO receiver may exceed the potential of the receiver’s power supply (that is, a GMII driver
powered from a 3.6-V supply driving V
for dissimilar GMII driver and receiver supply potentials is implicit in these specifications. The RGMII
and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
24
Supply voltage 3.3 V
Output high voltage (LV
Output low voltage (LV
Input high voltage
Input low voltage
Input high current (V
Input low current (V
Notes:
1. LV
2. TV
3. The symbol V
Supply voltage 2.5 V
Output high voltage (LV
Output low voltage (LV
Input high voltage
Input low voltage
Input current (V
Notes:
1. LV
2. TV
3. The symbol V
DD
DD
DD
DD
supports eTSEC1.
supports eTSEC1.
supports eTSEC3.
supports eTSEC3.
eTSEC DC Electrical Characteristics
Table 22. GMII, MII, RMII, RGMII, RTBI, TBI, and FIFO DC Electrical Characteristics
IN
IN
IN
= 0, V
, in this case, represents the LV
, in this case, represents the LV
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 5
IN
IN
= GND)
Table 21. GMII, MII, TBI, RMII and FIFO DC Electrical Characteristics
DD
DD
= LV
DD
DD
Parameters
IN
Parameter
/TV
/TV
Table 21
/TV
/TV
= LV
DD
DD
DD
DD
DD
, V
DD
= Min, I
= Min, I
IN
= Min, I
= Min, I
, V
= TV
IN
and
= TV
OL
OL
DD
OH
OH
Table
)
= 1.0 mA)
= 4.0 mA)
DD
= –4.0 mA)
= –1.0 mA)
)
OH
22. The potential applied to the input of a GMII, MII, TBI, RTBI,
IN
IN
into a GMII receiver powered from a 2.5-V supply). Tolerance
and TV
and TV
IN
IN
Section 9, “Ethernet Management Interface Electrical
symbols referenced in
symbols referenced in
LV
Symbol
Symbol
DD
TV
LV
V
V
V
V
V
V
V
V
I
I
I
OH
IH
OH
IN
OL
IL
/TV
OL
IH
IH
DD
IL
IL
DD
DD
3.135
2.375
–600
1.95
1.70
Min
Min
2.4
2.0
—
—
—
—
—
—
Table 1
Table 1
and
and
3.465
2.625
Max
0.90
Max
±15
0.5
0.4
0.7
40
—
—
—
—
—
Table
Table
Freescale Semiconductor
2.
2.
Unit
Unit
μA
μA
μA
V
V
V
V
V
V
V
V
V
V
Notes
1, 2, 3
1, 2, 3
Notes
1, 2
1, 2
—
—
—
—
—
—
—
—
3