MPC8347VRADDB Freescale Semiconductor, MPC8347VRADDB Datasheet - Page 20

IC MPU POWERQUICC II 620-PBGA

MPC8347VRADDB

Manufacturer Part Number
MPC8347VRADDB
Description
IC MPU POWERQUICC II 620-PBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheets

Specifications of MPC8347VRADDB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
266MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
620-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8349E-MITXE
Maximum Clock Frequency
266 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
266MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
BGA
No. Of Pins
672
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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DDR and DDR2 SDRAM
Figure 5
20
At recommended operating conditions with GV
266 MHz
200 MHz
MDQS preamble start
MDQS epilogue end
Notes:
1. The symbols for timing specifications follow the pattern of t
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MECC/MDM/MDQS. For the
4. t
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), ECC
6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that t
and t
the rising or falling edge of the reference clock (KH or KL) until the output goes invalid (AX or DX). For example, t
symbolizes DDR timing (DD) for the time t
set up (S) or output valid time. Also, t
low (L) until data outputs (D) are invalid (X) or data output hold time.
ADDR/CMD setup and hold specifications, it is assumed that the clock control register is set to adjust the memory clocks by
1/2 applied cycle.
rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). t
DQSS override bits in the TIMING_CFG_2 register and is typically set to the same delay as the clock adjust in the CLK_CNTL
register. The timing parameters listed in the table assume that these two parameters are set to the same adjustment value.
See the MPC8349EA PowerQUICC II Pro Integrated Host Processor Family Reference Manual for the timing modifications
enabled by use of these bits.
(MECC), or data mask (MDM). The data strobe should be centered inside the data eye at the pins of the microprocessor.
symbol conventions described in note 1.
DDKHMH
(first two letters of functional block)(reference)(state)(signal)(state)
shows the DDR SDRAM output timing for the MCK to MDQS skew measurement (t
follows the symbol conventions described in note 1. For example, t
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
Table 20. DDR and DDR2 SDRAM Output AC Timing Specifications (continued)
Parameter
MCK[n]
MCK[n]
MDQS
MDQS
DDKLDX
Figure 5. Timing Diagram for t
DD
of (1.8 or 2.5 V) ± 5%.
MCK
symbolizes DDR timing (DD) for the time t
memory clock reference (K) goes from the high (H) state until outputs (A) are
t
Symbol
DDKHMH(min) = –0.6 ns
t
t
t
DDKHMP
DDKHME
DDKHMHmax) = 0.6 ns
t
MCK
for outputs. Output hold time can be read as DDR timing (DD) from
(first two letters of functional block)(signal)(state)(reference)(state)
1
–0.5 × t
1100
1200
–0.6
DDKHMH
Min
DDKHMH
MCK
DDKHMH
– 0.6
describes the DDR timing (DD) from the
can be modified through control of the
MCK
–0.5 × t
memory clock reference (K) goes
Max
0.6
MCK
Freescale Semiconductor
+ 0.6
DDKHMP
Unit
follows the
ns
ns
DDKHMH
for inputs
DDKHAS
Notes
6
6
).

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