MPC8347VRADDB Freescale Semiconductor, MPC8347VRADDB Datasheet - Page 16

IC MPU POWERQUICC II 620-PBGA

MPC8347VRADDB

Manufacturer Part Number
MPC8347VRADDB
Description
IC MPU POWERQUICC II 620-PBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC II PROr
Datasheets

Specifications of MPC8347VRADDB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
266MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
620-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8349E-MITXE
Maximum Clock Frequency
266 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Core Size
32 Bit
Program Memory Size
64KB
Cpu Speed
266MHz
Embedded Interface Type
I2C, SPI, USB, UART
Digital Ic Case Style
BGA
No. Of Pins
672
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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DDR and DDR2 SDRAM
Table 13
Table 14
GV
16
Output low current (V
Notes:
1. GV
2. MV
3. V
4. Output leakage is measured with all outputs disabled, 0 V
Input/output capacitance: DQ, DQS, DQS
Delta input/output capacitance: DQ, DQS, DQS
Note:
1. This parameter is sampled. GV
I/O supply voltage
I/O reference voltage
I/O termination voltage
Input high voltage
Input low voltage
Output leakage current
Output high current (V
Output low current (V
Notes:
1. GV
2. MV
3. V
4. Output leakage is measured with all outputs disabled, 0 V
on MV
MV
noise on MV
equal to MV
DD
TT
TT
DD
REF
REF
DD
REF
is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to equal
is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be
(typ) = 2.5 V
is expected to be within 50 mV of the DRAM GV
is expected to be within 50 mV of the DRAM GV
REF
. This rail should track variations in the DC level of MV
is expected to equal 0.5 × GV
is expected to be equal to 0.5 × GV
provides the DDR2 capacitance when GV
provides the recommended operating conditions for the DDR SDRAM component(s) when
Table 12. DDR2 SDRAM DC Electrical Characteristics for GV
Parameter/Condition
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
cannot exceed ±2% of the DC value.
REF
REF
. This rail should track variations in the DC level of MV
Parameter/Condition
Table 14. DDR SDRAM DC Electrical Characteristics for GV
may not exceed ±2% of the DC value.
OUT
OUT
OUT
.
= 0.280 V)
= 0.35 V)
= 1.95 V)
Table 13. DDR2 SDRAM Capacitance for GV
DD
= 1.8 V ± 0.090 V, f = 1 MHz, T
DD
, and to track GV
DD
, and to track GV
Symbol
MV
GV
V
V
I
I
V
I
I
OH
OL
OZ
OL
TT
IH
REF
IL
DD
DD
DD
DD
at all times.
at all times.
DD
DC variations as measured at the receiver. Peak-to-peak noise
V
V
REF
Symbol
(typ) =
OUT
OUT
MV
MV
DD
0.49 × GV
C
C
.
DIO
A
IO
REF
REF
DC variations as measured at the receiver. Peak-to-peak
13.4
2.375
–15.2
–0.3
–9.9
15.2
= 25°C, V
Min
GV
GV
1.8 V.
REF
+ 0.18
– 0.04
DD
DD
.
DD
.
.
OUT
DD
Min
6
DD
(typ) = 1.8 V
= GV
(typ) = 1.8 V (continued)
MV
MV
0.51 × GV
GV
DD
DD
REF
REF
2.625
DD
Max
–9.9
/2, V
(typ) = 2.5 V
+ 0.04
+ 0.3
– 0.18
Max
0.5
OUT
8
DD
(peak-to-peak) = 0.2 V.
Freescale Semiconductor
Unit
Unit
mA
mA
mA
μA
pF
pF
V
V
V
V
V
Notes
Notes
1
2
3
4
1
1

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