EPM7512BFC256-5 Altera, EPM7512BFC256-5 Datasheet - Page 14

• Manufacturer Part Number: EPM7512BFC256-5
• Description: IC MAX 7000 CPLD 512 256-FBGA
• Manufacturer: Altera
• Series: MAX® 7000Br

Specifications of EPM7512BFC256-5

• Programmable Type: In System Programmable
• Delay Time Tpd(1) Max: 5.5ns
• Voltage Supply - Internal: 2.375 V ~ 2.625 V
• Number Of Logic Elements/blocks: 32
• Number Of Macrocells: 512
• Number Of Gates: 10000
• Number Of I /o: 212
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 256-FBGA
• Voltage: 2.5V
• Memory Type: EEPROM
• Number Of Logic Elements/cells: 32
• Family Name: MAX 7000B
• # Macrocells: 512
• Number Of Usable Gates: 10000
• Frequency (max): 166.67MHz
• Propagation Delay Time: 5.5ns
• Number Of Logic Blocks/elements: 32
• # I/os (max): 212
• Operating Supply Voltage (typ): 2.5V
• In System Programmable: Yes
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (max): 2.625V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: FBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant
• Other names: 544-2361

MAX 7000B Programmable Logic Device Data Sheet
SameFrame
Pin-Outs
14
MAX 7000B devices support the SameFrame pin-out feature for
FineLine BGA and 0.8-mm Ultra FineLine BGA packages. The
SameFrame pin-out feature is the arrangement of balls on FineLine BGA
and 0.8-mm Ultra FineLine BGA packages such that the lower-ball-count
packages form a subset of the higher-ball-count packages. SameFrame
pin-outs provide the flexibility to migrate not only from device to device
within the same package, but also from one package to another. FineLine
BGA packages are compatible with other FineLine BGA packages, and
0.8-mm Ultra FineLine BGA packages are compatible with other 0.8-mm
Ultra FineLine BGA packages. A given printed circuit board (PCB) layout
can support multiple device density/package combinations. For example,
a single board layout can support a range of devices from an EPM7064B
device in a 100-pin FineLine BGA package to an EPM7512B device in a
256-pin FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to layout a board to
take advantage of this migration (see
Figure 7. SameFrame Pin-Out Example
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
Designed for 256-Pin FineLine BGA Package
FineLine
100-Pin
BGA
Printed Circuit Board
Figure
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
7).
FineLine
256-Pin
BGA
Altera Corporation