EP3C16F256I7N Altera, EP3C16F256I7N Datasheet - Page 267

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EP3C16F256I7N

Manufacturer Part Number
EP3C16F256I7N
Description
Cyclone III
Manufacturer
Altera
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IEEE Std. 1149.1 BST Architecture
© December 2009
CIII51014-2.2
f
1
Altera Corporation
This chapter provides guidelines on using the IEEE Std. 1149.1 boundary-scan test
(BST) circuitry in Cyclone
BST architecture tests pin connections without using physical test probes, and
captures functional data while a device is operating normally. Boundary-scan cells
(BSCs) in a device can force signals onto pins or capture data from pin or logic array
signals. Forced test data is serially shifted into the boundary-scan cells. Captured data
is serially shifted out and externally compared to expected results.
This chapter contains the following sections:
Cyclone III device family operating in the IEEE Std. 1149.1 BST mode use four
required pins:
The TCK pin has an internal weak pull-down resistor, while the TDI and TMS pins
have weak internal pull-up resistors. The TDO output pin and all the JTAG input pins
are powered by the 2.5-V or 3.0-V V
JTAG configuration.
For recommendations on how to connect a JTAG chain with multiple voltages across
the devices in the chain, refer to
For more information about the description and functionality of all JTAG pins,
registers used by the IEEE Std. 1149.1 BST circuitry, and the test access port (TAP)
controller, refer to
“IEEE Std. 1149.1 BST Architecture” on page 12–1
“IEEE Std. 1149.1 BST Operation Control” on page 12–2
“I/O Voltage Support in a JTAG Chain” on page 12–5
“Guidelines for IEEE Std. 1149.1 BST” on page 12–6
“Boundary-Scan Description Language Support” on page 12–7
TDI
TDO
TMS
TCK
AN39: IEEE 1149.1 (JTAG) Boundary-Scan Testing in Altera
Testing for the Cyclone III Device Family
12. IEEE 1149.1 (JTAG) Boundary-Scan
®
III device family (Cyclone III and Cyclone III LS devices).
“I/O Voltage Support in a JTAG Chain” on page
CCIO
supply. All user I/O pins are tri-stated during
Cyclone III Device Handbook, Volume 1
Devices.
12–5.

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