ADSP-BF527KBCZ-6 Analog Devices Inc, ADSP-BF527KBCZ-6 Datasheet - Page 86

• Manufacturer Part Number: ADSP-BF527KBCZ-6
• Description: ADSP-BF527 Processor,600Mhz,Ethernet,USB
• Manufacturer: Analog Devices Inc
• Series: Blackfin®r
• Type: Fixed Pointr

Specifications of ADSP-BF527KBCZ-6

• Interface: DMA, Ethernet, I²C, PPI, SPI, SPORT, UART, USB
• Clock Rate: 600MHz
• Non-volatile Memory: ROM (32 kB)
• On-chip Ram: 132kB
• Voltage - I/o: 1.8V, 2.5V, 3.3V
• Voltage - Core: 1.10V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 289-CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADZS-BF527-MPSKIT - BOARD EVAL MEDIA PLAYER BF527ADZS-BF527-EZLITE - BOARD EVAL ADSP-BF527
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SURFACE-MOUNT DESIGN
Table 70
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 70. Surface-Mount Design Supplement
AUTOMOTIVE PRODUCTS
The ADBF525W model is available with controlled manufactur-
ing to support the quality and reliability requirements of
automotive applications. Note that these automotive models
may have specifications that differ from the commercial models
and designers should review the product Specifications section
Table 71. Automotive Products
1
2
3
Automotive Models
ADBF525WBBCZ4xx
ADBF525WBBCZ5xx
Package
289-Ball CSP_BGA
208-Ball CSP_BGA
Z = RoHS Compliant Part.
The use of xx designates silicon revision.
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see
ADSP-BF522/ADSP-BF523/ADSP-BF524/ADSP-BF525/ADSP-BF526/ADSP-BF527
Processors on Page 29
is provided as an aid to PCB design. For industry-stan-
for junction temperature (T
1,2
CORNER
A1 BALL
Temperature
Range
–40ºC to +85ºC
–40ºC to +85ºC
* 1.75
1.61
1.46
3
Package Ball Attach Type
Solder Mask Defined
Solder Mask Defined
J
) specification which is the only temperature specification.
* COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH
EXCEPTION TO PACKAGE HEIGHT AND BALL DIAMETER.
DETAIL A
TOP VIEW
Package Description
208-Ball CSP_BGA
208-Ball CSP_BGA
17.10
17.00 SQ
16.90
Figure 81. 208-Ball CSP_BGA (BC-208-2)
Rev. B | Page 86 of 88 | May 2010
SEATING
PLANE
BSC SQ
15.20
BSC
of this datasheet carefully. Only the automotive grade products
shown in
tions. Contact your local ADI account representative for specific
product ordering information and to obtain the specific Auto-
motive Reliability reports for these models.
0.80
Package Solder Mask
Opening
0.26 mm diameter
0.40 mm diameter
20
19
DETAIL A
18
17
Table 71
Operating Conditions for ADSP-BF523/ADSP-BF525/ADSP-BF527
16
DIAMETER
15
BOTTOM VIEW
* 0.50
14
BALL
0.45
0.40
13
12
11
10
are available for use in automotive applica-
9
INDEX AREA
8
COPLANARITY
0.12
A1 CORNER
7
6
1.36
1.26
1.16
5
4
0.35 NOM
0.30 MIN
3
2
1
B
C
D
E
F
H
K
L
M
N
P
R
T
U
A
G
J
V
W
Y
Package Ball Pad Size
0.35 mm diameter
0.50 mm diameter
Package
Option
BC-208-2
BC-208-2
Instruction
Rate (Max)
400 MHz
533 MHz