470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 7

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470-3105-100

Manufacturer Part Number
470-3105-100
Description
Manufacturer
Amphenol
Type
Backplaner
Datasheet

Specifications of 470-3105-100

Gender
HDR
Body Orientation
Straight
Number Of Contact Rows
4
Number Of Contacts
300POS
Termination Method
Solder
Mounting Style
Surface Mount
Lead Free Status / RoHS Status
Compliant
Example – Differential Routing:
two runs. *Note: the runs are parallel to the wafer – providing the most routing space.
Trace Routing Details
*
used. For more detail, see selection matrix in section 6.0 – “Solder Paste Process”
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
• Maximum recommended board warp – 7 mils/inch*.
• Preferred maximum board warp - 5 mils/inch*.
Note: The recommended board warp is also based on the assembly process stencil thickness
7 mil space. Routing from both sides may further reduce the layer count. The following pattern shows a
7 mil space. Routing from both sides may further reduce the layer count. The following pattern shows a
“Serpentine” trace pattern, and this routing pattern can be achieved using the exact pad and via footprint
“Serpentine” trace pattern, and this routing pattern can be achieved using the exact pad and via footprint
stated previously. The diagram below is an example of a possible starting point.
stated previously. The diagram below is an example of a possible starting point.
(Sufficient for surface finishes that have less than
.001” thickness variation such as OSP, ENIG,
Immersion Tin and Silver.)
(May be required if using a HASL surface finish)
3.3 PCB General Requirements and Routing Example
The NeXLev connector can be routed from one side using five layers - each with two 6 mil traces with a
DFM and SMT Assembly Guideline
Requirements
Requirements
Shows a 6-mil trace with a 7-mil space, in a “serpentine” pattern allowing for
• Minimizes the risk of opens
• Minimizes the risk of opens while allowing for
other variables such as solder paste height and
pad flatness*.
DFM Impact/Benefit
ers - each with two 6 mil traces with a
Landing Pad Layout
Page 7 of 29
Connector Side
Revision “E“
TB-2082

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