470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 26

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

9.0 Double Sided Reflow Process
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
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* Refer to Addendum “A” for more detailed information on weight/ball by part number. All connector
sizes up to, and including 10.5 mm tall, should not be an issue. However, because every assembly
process is not the same, the customer may want to verify this in their process. The 15.5 and 23.5 mm
receptacles will require specific testing for each process and design application, because the
weight/ball is close to the allowable limits of calculated surface tension forces.
Note: The final decision to run NexLev connectors upside down, without any secondary method of
retention, is with the customer. For more information on possible methods of retention – contact
Amphenol TCS.
The majority of the connectors can run upside
down in a double-sided reflow process.
Preferred to run the heavier* NexLev
connectors through the 2
sided reflow process.
Before running connectors upside down,
inspect connector to insure that housing is
seated to the board surface – see Reflow
Process section for more info.
Because of the surface tension forces created by a NeXLev solder joint, the majority of connector sizes
can run upside down in a double sided reflow process.
DFM and SMT Assembly Guideline
Requirements
nd
pass of a double-
• Surface tension forces of the solder joint are greater
• Prevents the need to run heavier devices through
• Improperly seated connectors indicate incorrect
than the weight/ball forces.
reflow upside down – minimizing the risk of the
connector falling off or sagging away from the
board.
reflow and possible cold and/or insufficient solder
joints, therefore reducing the surface tension forces
required to hold the part on the board.
DFM Impact/Benefit
Page 26 of 29
Revision “E“
TB-2082