470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 4

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

2.0 Design Introduction – NeXLev Connector
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
signal contacts, with each signal wafer having integral strip-line shielding. This wafer construction
allows for the contacts to be spaced on a 1.5mm x 1.75mm grid. The connector can be specified in
separation heights ranging from 10mm to 30mm.
board. Designed with solder joint reliability in mind, the connector has a mechanically compliant
structure, and is readily applied using standard SMT processes. Standard versions of the NeXLev
connector contain either 10, 20 or 30 wafers. (100, 200, or 300 positions)
a .76 mm (30 Mil) eutectic ball, re-flowed on the end of a formed pedestal.
One wafer contains 10 signal and 9 g
balls and the connector is provided in 10,
20, and 30 wafer configurations.
DFM and SMT Assembly Guideline
The NeXLev connector is a wafer construction organized in a 10-row by up to 30 columns of
The connector is a completely SMT attach, utilizing ball grid technology for termination to the
The connector is different than a standard BGA device, due to the compliant structure, which has
round
Ground Shield
Ball is attached to a
pedestal at the end of
the “S-Bend”
Compliant Lead
Page 4 of 29
S-Bend
Compliant Lead
Revision “E“
TB-2082