470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 16

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

5.0 Connector Handling
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
• Connectors should be kept in the original
• Once the assembly run is complete, tray should
• It is not necessary to bag and re-vacuum seal*
• Place tray flat on rack for storage or transport –
• SMT operators should minimize the handling of
Molded Top Cover
more susceptible to handling damage than a standard BGA device.
packaging until they’re used.
be removed from machine, placed back into the
bottom pan, replace top cover, and Velcro strap
together – as shown below. (For more detail refer
to TB-2121)
the tray, if the parts are used within a reasonable
time frame for eutectic solder balls – shelf life is
dependent on stockroom environmental
conditions.
don’t place on edge.
the part that could cause bent leads, such as
moving parts around in the JEDEC tray,
removing from sticky tape during program
verification, placing the part on a workbench
with the ball field down, etc.
The NeXLev connector is an assembly, with the solder balls attached to leaded pedestals, and is thus
DFM and SMT Assembly Guideline
Requirements
Bottom Pan and JEDEC Tray
Partially loaded tray
• Protects the ball field until it can be loaded into the
• Protection of ball field.
• NeXLev Connector materials are not moisture
• Prevents parts from moving out of tray slot, and
• Minimizes bent leads, true position problems, and
placement machine
sensitive, and do not require pre-bake.
potentially bending leads, which support the solder
balls.
post reflow shorting.
DFM Impact/Benefit
Two Velcro straps
located as shown.
Page 16 of 29
Revision “E“
TB-2082