470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 13

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

4.0 Manufacturing Introduction – NeXLev Connector
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
device. The connector is not as fragile as a fine-pitch leaded device, but does require some of the pre-
cautions. Improper handling can bend the compliant lead and result in ball locations outside of true position
tolerances.
One wafer contains 10 signal and 9 ground
balls and the connector is provided in 10,
20, and 30 wafer configurations.
signal contacts, with each signal wafer having integral strip line shielding. This wafer construction
allows for the contacts to be spaced on a 1.5mm x 1.75mm grid. The connector can be specified in
separation heights ranging from 10mm to 30mm.
board. Designed with solder joint reliability in mind, the connector has a mechanically compliant
structure and is readily applied using standard SMT processes. Standard versions of the NeXLev
connector contain either 10, 20 or 30 wafers. (100, 200 or 300 positions)
a .76 mm (30 Mil) eutectic ball, re-flowed on the end of a formed pedestal.
The compliant structure requires that the connectors be handled with more care than a standard BGA
DFM and SMT Assembly Guideline
The NeXLev connector is a wafer construction organized in a 10-row by up to 30 columns of
The connector is a completely SMT attach, utilizing ball grid technology for termination to the
The connector is different than a standard BGA device, due to the compliant structure, which has
Ground Shield
Ball is attached to a
pedestal at the end of
the “S-Bend”
Compliant Lead
Page 13 of 29
S-Bend
Compliant Lead
Revision “E“
TB-2082