470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 23

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

8.0 Reflow Process
Note: NeXLev plugs are more commonly profiled incorrectly. The housing is open, and the plug wafer
construction transfers heat more readily than the receptacle. The plug ball-field can get to reflow
temperatures much quicker than the board. This thermal differential may require the lower oven heaters
to be set hotter than the upper heaters, providing thermal balance between the board and connector.
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
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To determine correct oven settings, follow
standard reflow profile processes for set-up and
placement of thermal probes.
Locate one thermal probe on top of the
connector housing during reflow profiling – It is
preferred to keep the plastic below 260°C with a
max allowable temperature of 280°C.
Locate at least (2) thermal probes – one on an
outer ball, and one on an inner ball – may
require drilling through the board
Set process to the solder paste vendor’s
recommended profile.
After first-side reflow process, inspect connector
to insure that housing is seated to the board
surface – see below.
(Primarily required for larger receptacle connectors
Connector housing is
Locate one thermal probe
and may require drilling through board)
Locate one thermal probe on inner ball
seated to PCB
DFM and SMT Assembly Guideline
on housing
Requirements
NeXLev Assembled to PCB After First Reflow
• Insure even heat distribution across the part.
• Insures against plastic over-heating and damage.
• Insures balanced reflow profile definition for all
• This varies by the chemical make-up of each
• This insures good reflow and balls have
of the solder joints.
solder paste, and also varies from one paste
vendor to the next.
completely collapsed. Unseated connectors are
due to improperly reflowed balls, and could result
in long-term reliability failures.
DFM Impact/Benefit
Locate one thermal probe
on outer ball
PCB
Page 23 of 29
Revision “E“
TB-2082