470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 12
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470-3105-100
Manufacturer Part Number
470-3105-100
Description
Manufacturer
Amphenol
Type
Backplaner
Datasheet
1.470-3105-100.pdf
(29 pages)
Specifications of 470-3105-100
Gender
HDR
Body Orientation
Straight
Number Of Contact Rows
4
Number Of Contacts
300POS
Termination Method
Solder
Mounting Style
Surface Mount
Lead Free Status / RoHS Status
Compliant
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
• Preferred to have 5mm clearance between
Fragile Device – Micro
5mm minimum preferred
clearance to fragile
devices
components.
tall, > 15.5mm NeXLev connectors, or, to
other surrounding components of similar
height.
BGA, CGA, Leaded
3.8 Keep-out Zone and Clearances – Multi Connector and Connector heights > 15.5mm
Fine Pitch, etc.
This NeXLev connector keep-out zone is required for re-work capability of taller devices with taller adjacent
DFM and SMT Assembly Guideline
Requirements
• Allow room/clearance for site cleaning and preparation,
• Prevents re-reflow of adjacent device, which could
• Eliminates the need for reflow shielding of smaller
and manual paste application using micro stencil.
cause shorts/defects on that device.
thermal mass components
5mm Preferred clearance
between tall components
DFM Impact/Benefit
Tall adjacent
components
Page 12 of 29
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