470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 24

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Copyright © Amphenol Corporation 2005-2008 • All rights reserved
establishing the best profile. (This method is destructive and requires the use of a solder sample)
8.1 Reflow Process – Detailed Verification and De-bug
Below is the recommended method for process debug or 100% verification of process set-up and
•
•
•
•
• Solder joints are
DFM and SMT Assembly Guideline
Inspect connector to insure that the housing has completely settled to the board surface
Pry the housing from the board surface using a sharp edge - wedged between the housing and board
surface – pry the ends only. Insure wedge doesn’t go too deep and catch a wafer.
Housing will break away from wafers at heat-staked joint.
Lift housing off wafers parallel
to the board surface
Pry Point
exposed to allow
100% visual
inspection
•
Spread wafers to reveal ball field
Pry Points
Page 24 of 29
Revision “E“
TB-2082