470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 11

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

Copyright © Amphenol Corporation 2005-2008 • All rights reserved
• The recommended minimum clearance required is
• It’s preferred to have 5mm clearance to adjacent
the connector housing for rework tooling and nozzles.
3mm – preferred clearance is 4mm to non-fragile
adjacent components.
devices that are very fine pitch with small thermal
mass, and could re-reflow – this is dependent on
board thickness, copper weight and NeXLev height
Leaded Fine Pitch, etc.
3.7 Keep-out Zone and Clearances – Connector height < 10.5mm
The NeXLev connector keep-out zone is required for re-work capability. This allows clearance around
Micro BGA, CGA,
5mm Preferred clearance
to fragile devices
Fragile Devices –
DFM and SMT Assembly Guideline
Requirements
• Rework nozzle - physical clearance
• Prevents re-reflow of adjacent device, which
could cause shorts/defects on that device.
3mm Minimum - physical
clearance for rework nozzle
4mm Preferred clearance
to Non-fragile devices
Rework Nozzle
DFM Impact/Benefit
Non-Fragile Devices –
Leaded - 50 mil pitch,
chips, etc.
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Revision “E“
TB-2082