470-3105-100 Amphenol, 470-3105-100 Datasheet - Page 17

• Manufacturer Part Number: 470-3105-100
• Manufacturer: Amphenol
• Type: Backplaner

Specifications of 470-3105-100

• Gender: HDR
• Body Orientation: Straight
• Number Of Contact Rows: 4
• Number Of Contacts: 300POS
• Termination Method: Solder
• Mounting Style: Surface Mount
• Lead Free Status / RoHS Status: Compliant

6.0 Solder Paste Process
*A 5 mil stencil thickness can be used, but requires either a .005”/inch board warp spec, or a .001” pad
co planarity spec on surface finish thickness variability. (HASL finishes can exceed this limitation.)
Board Warp Matrix - The following matrix defines the board warp spec required for each of the listed
Copyright © Amphenol Corporation 2005-2008 • All rights reserved
• Liquid Photo-Imageable (LPI) solder mask
• Preferred to use a 6 mil stencil (Minimum
• Recommended to use a reduced aperture -
over bare copper is preferred.
stencil thickness of 5 mil)*
.021”
and Paste Process
Stencil Thickness
Variation
DFM and SMT Assembly Guideline
Requirements
variables – Stencil Thickness and Pad Finish Co-planarity
6 mil +2/-0 mils
5 mil +2/-.5 mil
6 mil +2/-.5 mil
5 mil +2/-0 mil
• Most common – provides best adhesion for solder
• Minimizes the risk of opens
• Minimizes the risk of shorting
mask - preventing peeling and flaking of mask
during assembly processes.
<.001”
.007”
.005”
.007”
.007”
Pad Finish Co-planarity
DFM Impact/Benefit
Not Recommended
<.002”
.005”
.007”
.005”
Page 17 of 29
Revision “E“
TB-2082