XQ2V1000-4BG575N Xilinx Inc, XQ2V1000-4BG575N Datasheet - Page 48

• Manufacturer Part Number: XQ2V1000-4BG575N
• Description: FPGA 650MHZ CMOS1.5V 575-P
• Manufacturer: Xilinx Inc
• Series: QPro™ Virtex™-IIr

Specifications of XQ2V1000-4BG575N

• Number Of Labs/clbs: 1280
• Total Ram Bits: 737280
• Number Of I /o: 328
• Number Of Gates: 100000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 575-BBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Logic Elements/cells: -
• Other names: Q5801737

QPro Virtex-II Electrical Characteristics
QPro Virtex-II devices are only available with the -5 and-4
speed grades. QPro Virtex-II DC and AC characteristics are
specified for military grade. Except for the operating
temperature range, or unless otherwise noted, all the DC
and AC electrical parameters are the same for a particular
speed grade (that is, the timing characteristics of a -4 speed
grade military device are the same as for a -4 speed grade
QPro Virtex-II DC Characteristics
Table 31: Absolute Maximum Ratings
Table 32: Recommended Operating Conditions
DS122 (v2.0) December 21, 2007
Product Specification
Notes:
1.
2.
3.
Notes:
1.
2.
3.
4.
5.
Symbol
V
V
V
Symbol
V
V
CCAUX
V
CCINT
V
V
V
BATT
Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
For soldering guidelines and thermal considerations, see the
Inputs configured as PCI are fully PCI compliant. This statement takes precedence over any specification that would imply that the device is
not PCI compliant.
CCO
If battery is not used, do not connect V
Recommended maximum voltage droop for V
The thresholds for Power On Reset are V
Limit the noise at the power supply to be within 200 mV peak-to-peak.
For power bypassing guidelines, see
V
T
T
CCAUX
CCINT
V
BATT
CCO
IN
REF
STG
SOL
T
TS
J
(3)
Internal supply voltage relative to GND
Auxiliary supply voltage relative to GND
Supply voltage relative to GND
Battery voltage relative to GND
R
Internal supply voltage relative to GND
Auxiliary supply voltage relative to GND
Output drivers supply voltage relative to GND
Key memory battery backup supply
Input reference voltage
Input voltage relative to GND (user and dedicated I/Os)
Voltage applied to 3-state output (user and dedicated I/Os)
Storage temperature (ambient)
Maximum soldering temperature
Operating junction temperature
[Ref
BATT
CCINT
2].
.
(2)
CCAUX
Description
> 1.2V, V
Description
is 10 mV/ms.
CCAUX
www.xilinx.com
(1)
Device Packaging
> 2.5V, and V
commercial device). All supply voltage and junction
temperature specifications are representative of worst-case
conditions. The parameters included are common to
popular designs and typical applications. Contact Xilinx for
design considerations requiring more detailed information.
All specifications are subject to change without notice.
CCO
information on the Xilinx website.
(Bank 4) > 1.5V.
QPro Virtex-II 1.5V Platform FPGAs
–0.5 to V
–0.5 to V
–0.5 to 1.65
–65 to +150
–0.5 to 4.0
–0.5 to 4.0
–0.5 to 4.0
–0.5 to 4.0
3.135
1.425
Min
1.2
Value
1.0
+220
+125
CCO
CCO
+ 0.5
+ 0.5
3.465
1.575
Max
3.6
3.6
Units
Units
°C
°C
°C
V
V
V
V
V
V
V
V
V
V
V
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