SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 96
![IC TXRX MCU + EZRADIOPRO](/photos/14/21/142131/42-qfn-series_sml.jpg)
SI1000-C-GM
Manufacturer Part Number
SI1000-C-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Specifications of SI1000-C-GM
Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-121dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
85mA
Data Interface
PCB, Surface Mount
Memory Size
64kB Flash, 4kB RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
20 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4.1 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
4352 B
Supply Current (max)
4.1 mA
Cpu Family
Si100x
Device Core
8051
Device Core Size
8b
Frequency (max)
25MHz
Total Internal Ram Size
4.25KB
# I/os (max)
22
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
18-chx10-bit
Instruction Set Architecture
CISC
Mounting
Surface Mount
Pin Count
42
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1881-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI1000-C-GM
Manufacturer:
FSC
Quantity:
1 000
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Si1000/1/2/3/4/5
5.9. Internal Voltage References
For applications requiring the maximum number of port I/O pins, or very short VREF turn-on time, the
1.65 V high-speed reference will be the best internal reference option to choose. The high speed internal
reference is selected by setting REFSL[1:0] to 11. When selected, the high speed internal reference will be
automatically enabled/disabled on an as-needed basis by ADC0.
For applications requiring the highest absolute accuracy, the 1.68 V precision voltage reference will be the
best internal reference option to choose. The 1.68 V precision reference may be enabled and selected by
setting REFOE to 1 and REFSL[1:0] to 00. An external capacitor of at least 0.1 µF is recommended when
using the precision voltage reference.
In applications that leave the precision internal oscillator always running, there is no additional power
required to use the precision voltage reference. In all other applications, using the high speed reference
will result in lower overall power consumption due to its minimal startup time and the fact that it remains in
a low power state when an ADC conversion is not taking place.
Note: When using the precision internal oscillator as the system clock source, the precision voltage refer-
ence should not be enabled from a disabled state. To use the precision oscillator and the precision voltage
reference simultaneously, the precision voltage reference should be enabled first and allowed to settle to
its final value (charging the external capacitor) before the precision oscillator is started and selected as the
system clock.
For applications with a non-varying power supply voltage, using the power supply as the voltage reference
can provide ADC0 with added dynamic range at the cost of reduced power supply noise rejection. To use
the 1.8 to 3.6 V power supply voltage (VDD_MCU) or the 1.8 V regulated digital supply voltage as the ref-
erence source, REFSL[1:0] should be set to 01 or 10, respectively.
5.10. Analog Ground Reference
To prevent ground noise generated by switching digital logic from affecting sensitive analog measure-
ments, a separate analog ground reference option is available. When enabled, the ground reference for
ADC0 during both the tracking/sampling and the conversion periods is taken from the P0.1/AGND pin. Any
external sensors sampled by ADC0 should be referenced to the P0.1/AGND pin. This pin should be con-
nected to the ground terminal of any external sensors sampled by ADC0. If an external voltage reference is
used, the P0.1/AGND pin should be connected to the ground of the external reference and its associated
decoupling capacitor. If the 1.68 V precision internal reference is used, then P0.1/AGND should be con-
nected to the ground terminal of its external decoupling capacitor. The separate analog ground reference
option is enabled by setting REFGND to 1. Note that when sampling the internal temperature sensor, the
internal chip ground is always used for the sampling operation, regardless of the setting of the REFGND
bit. Similarly, whenever the internal 1.65 V high-speed reference is selected, the internal chip ground is
always used during the conversion period, regardless of the setting of the REFGND bit.
5.11. Temperature Sensor Enable
The TEMPE bit in register REF0CN enables/disables the temperature sensor. While disabled, the temper-
ature sensor defaults to a high impedance state and any ADC0 measurements performed on the sensor
result in meaningless data. See Section “5.6. Temperature Sensor” on page 92 for details on temperature
sensor characteristics when it is enabled.
96
Rev. 1.0
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