SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 184
![IC TXRX MCU + EZRADIOPRO](/photos/14/21/142131/42-qfn-series_sml.jpg)
SI1000-C-GM
Manufacturer Part Number
SI1000-C-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Specifications of SI1000-C-GM
Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-121dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
85mA
Data Interface
PCB, Surface Mount
Memory Size
64kB Flash, 4kB RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
20 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4.1 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
4352 B
Supply Current (max)
4.1 mA
Cpu Family
Si100x
Device Core
8051
Device Core Size
8b
Frequency (max)
25MHz
Total Internal Ram Size
4.25KB
# I/os (max)
22
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
18-chx10-bit
Instruction Set Architecture
CISC
Mounting
Surface Mount
Pin Count
42
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1881-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI1000-C-GM
Manufacturer:
FSC
Quantity:
1 000
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Si1000/1/2/3/4/5
Important Note on External Crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The
crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as
short as possible and shielded with ground plane from any other traces which could introduce noise or
interference.
When using an external crystal, the external oscillator drive circuit must be configured by software for Crys-
tal Oscillator Mode or Crystal Oscillator Mode with divide by 2 stage. The divide by 2 stage ensures that the
clock derived from the external oscillator has a duty cycle of 50%. The External Oscillator Frequency Con-
trol value (XFCN) must also be specified based on the crystal frequency. The selection should be based on
Table 19.1. For example, a 25 MHz crystal requires an XFCN setting of 111b.
When the crystal oscillator is first enabled, the external oscillator valid detector allows software to deter-
mine when the external system clock has stabilized. Switching to the external oscillator before the crystal
oscillator has stabilized can result in unpredictable behavior. The recommended procedure for starting the
crystal is:
1. Configure XTAL1 and XTAL2 for analog I/O and disable the digital output drivers.
2. Configure and enable the external oscillator.
3. Poll for XTLVLD => 1.
4. Switch the system clock to the external oscillator.
184
XFCN
000
001
010
100
101
011
110
111
Table 19.1. Recommended XFCN Settings for Crystal Mode
155 kHz f 415 kHz
415 kHz f 1.1 MHz
1.1 MHz f 3.1 MHz
3.1 MHz f 8.2 MHz
8.2 MHz f 25 MHz
58 kHz f 155 kHz
20 kHz f 58 kHz
Crystal Frequency
Figure 19.2. 25 MHz External Crystal Example
f 20 kHz
25 MHz
15 pF
15 pF
Rev. 1.0
Bias Current
120 µA
550 µA
2.6 mA
0.5 µA
1.5 µA
4.8 µA
14 µA
40 µA
10 M
XTAL1
XTAL2
Typical Supply Current
3.0 µA, f = 32.768 kHz
4.8 µA, f = 32.768 kHz
9.6 µA, f = 32.768 kHz
193 µA, f = 400 kHz
3.9 mA, f = 25 MHz
28 µA, f = 400 kHz
71 µA, f = 400 kHz
940 µA, f = 8 MHz
(VDD = 2.4 V)
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