SI1000-C-GM Silicon Laboratories Inc, SI1000-C-GM Datasheet - Page 183
![IC TXRX MCU + EZRADIOPRO](/photos/14/21/142131/42-qfn-series_sml.jpg)
SI1000-C-GM
Manufacturer Part Number
SI1000-C-GM
Description
IC TXRX MCU + EZRADIOPRO
Manufacturer
Silicon Laboratories Inc
Specifications of SI1000-C-GM
Package / Case
42-QFN
Frequency
240MHz ~ 960MHz
Data Rate - Maximum
256kbps
Modulation Or Protocol
FSK, GFSK, OOK
Applications
General Purpose
Power - Output
20dBm
Sensitivity
-121dBm
Voltage - Supply
1.8 V ~ 3.6 V
Current - Receiving
18.5mA
Current - Transmitting
85mA
Data Interface
PCB, Surface Mount
Memory Size
64kB Flash, 4kB RAM
Antenna Connector
PCB, Surface Mount
Number Of Receivers
1
Number Of Transmitters
1
Wireless Frequency
240 MHz to 960 MHz
Interface Type
UART, SMBus, SPI, PCA
Output Power
20 dBm
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Maximum Supply Current
4.1 mA
Minimum Operating Temperature
- 40 C
Modulation
FSK, GFSK, OOK
Protocol Supported
C2, SMBus
Core
8051
Program Memory Type
Flash
Program Memory Size
64 KB
Data Ram Size
4352 B
Supply Current (max)
4.1 mA
Cpu Family
Si100x
Device Core
8051
Device Core Size
8b
Frequency (max)
25MHz
Total Internal Ram Size
4.25KB
# I/os (max)
22
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
18-chx10-bit
Instruction Set Architecture
CISC
Mounting
Surface Mount
Pin Count
42
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1881-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI1000-C-GM
Manufacturer:
FSC
Quantity:
1 000
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Si1000/1/2/3/4/5
19.1. Programmable Precision Internal Oscillator
All Si1000/1/2/3/4/5 devices include a programmable precision internal oscillator that may be selected as
the system clock. OSCICL is factory calibrated to obtain a 24.5 MHz frequency. See Section “4. Electrical
Characteristics” on page 40 for complete oscillator specifications.
The precision oscillator supports a spread spectrum mode which modulates the output frequency in order
to reduce the EMI generated by the system. When enabled (SSE = 1), the oscillator output frequency is
modulated by a stepped triangle wave whose frequency is equal to the oscillator frequency divided by 384
(63.8 kHz using the factory calibration). The deviation from the nominal oscillator frequency is +0%, –1.6%,
and the step size is typically 0.26% of the nominal frequency. When using this mode, the typical average
oscillator frequency is lowered from 24.5 MHz to 24.3 MHz.
19.2. Low Power Internal Oscillator
All Si1000/1/2/3/4/5 devices include a low power internal oscillator that defaults as the system clock after a
system reset. The low power internal oscillator frequency is 20 MHz ± 10% and is automatically enabled
when selected as the system clock and disabled when not in use. See Section “4. Electrical Characteris-
tics” on page 40 for complete oscillator specifications.
19.3. External Oscillator Drive Circuit
All Si1000/1/2/3/4/5 devices include an external oscillator circuit that may drive an external crystal, ceramic
resonator, capacitor, or RC network. A CMOS clock may also provide a clock input. Figure 19.1 shows a
block diagram of the four external oscillator options. The external oscillator is enabled and configured
using the OSCXCN register.
The external oscillator output may be selected as the system clock or used to clock some of the digital
peripherals (e.g., Timers, PCA, etc.). See the data sheet chapters for each digital peripheral for details.
See Section “4. Electrical Characteristics” on page 40 for complete oscillator specifications.
19.3.1. External Crystal Mode
If a crystal or ceramic resonator is used as the external oscillator, the crystal/resonator and a 10 Mresis-
tor must be wired across the XTAL1 and XTAL2 pins as shown in Figure 19.1, Option 1. Appropriate load-
ing capacitors should be added to XTAL1 and XTAL2, and both pins should be configured for analog I/O
with the digital output drivers disabled.
Figure 19.2 shows the external oscillator circuit for a 20 MHz quartz crystal with a manufacturer recom-
mended load capacitance of 12.5 pF. Loading capacitors are "in series" as seen by the crystal and "in par-
allel" with the stray capacitance of the XTAL1 and XTAL2 pins. The total value of the each loading
capacitor and the stray capacitance of each XTAL pin should equal 12.5pF x 2 = 25 pF. With a stray capac-
itance of 10 pF per pin, the 15 pF capacitors yield an equivalent series capacitance of 12.5 pF across the
crystal.
Note: The recommended load capacitance depends upon the crystal and the manufacturer. Please refer to the crystal
data sheet when completing these calculations.
Rev. 1.0
183
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