MCIMX31LVKN5 Freescale Semiconductor, MCIMX31LVKN5 Datasheet - Page 12

• Manufacturer Part Number: MCIMX31LVKN5
• Description: IC MPU MAP I.MX31L 457-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX31r

Specifications of MCIMX31LVKN5

• Core Processor: ARM11
• Core Size: 32-Bit
• Speed: 532MHz
• Connectivity: 1-Wire, ATA, EBI/EMI, FIR, I²C, MMC/SD, PCMCIA, SIM, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, POR, PWM, WDT
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.22 V ~ 3.3 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 457-MAPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Electrical Characteristics
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1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
2. Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6.
3. Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board
4. Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The
5. Thermal characterization parameter indicating the temperature difference between the package
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
Thermal test board meets JEDEC specification for this package.
meets JEDEC specification for the specified package.
cold plate temperature is used for the case temperature. Reported value includes the thermal
resistance of the interface layer.
top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
NOTES
Freescale Semiconductor