MCIMX31LVKN5 Freescale Semiconductor, MCIMX31LVKN5 Datasheet - Page 11
![IC MPU MAP I.MX31L 457-MAPBGA](/photos/13/94/139453/mcimx31lvkn5_sml.jpg)
MCIMX31LVKN5
Manufacturer Part Number
MCIMX31LVKN5
Description
IC MPU MAP I.MX31L 457-MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX31r
Datasheet
1.MCIMX31LITEKITC.pdf
(122 pages)
Specifications of MCIMX31LVKN5
Core Processor
ARM11
Core Size
32-Bit
Speed
532MHz
Connectivity
1-Wire, ATA, EBI/EMI, FIR, I²C, MMC/SD, PCMCIA, SIM, SPI, SSI, UART/USART, USB, USB OTG
Peripherals
DMA, LCD, POR, PWM, WDT
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.22 V ~ 3.3 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
457-MAPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCIMX31LVKN5
Manufacturer:
ADI
Quantity:
9 710
Company:
Part Number:
MCIMX31LVKN5
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MCIMX31LVKN5B
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MCIMX31LVKN5BR2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MCIMX31LVKN5C
Manufacturer:
FREESCALE
Quantity:
1 831
Company:
Part Number:
MCIMX31LVKN5C
Manufacturer:
FREESCALE
Quantity:
748
Company:
Part Number:
MCIMX31LVKN5C
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MCIMX31LVKN5C
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MCIMX31LVKN5R2
Manufacturer:
IBM
Quantity:
284
Part Number:
MCIMX31LVKN5R2
Manufacturer:
FREESCALE
Quantity:
20 000
Table 6
Table 7
Freescale Semiconductor
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case (Top)
Junction to Package Top (natural convection)
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
5. Thermal resistance between the die and the case top surface as measured by the cold plate method
6. Thermal characterization parameter indicating the temperature difference between package top
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
specification.
temperature is measured on the top surface of the board near the package.
(MIL SPEC-883 Method 1012.1).
and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
provides the thermal resistance data for the 14 × 14 mm, 0.5 mm pitch package.
provides the thermal resistance data for the 19 × 19 mm, 0.8 mm pitch package.
Rating
Rating
Table 6. Thermal Resistance Data—14
Table 7. Thermal Resistance Data—19
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
NOTES
Board
—
—
—
Board
—
—
—
×
×
14 mm Package
19 mm Package
Symbol
Symbol
R
R
R
R
R
R
R
R
R
R
R
R
Ψ
θJCtop
Ψ
θJMA
θJMA
θJMA
θJMA
θJC
θJA
θJA
θJB
θJA
θJA
θJB
JT
JT
Value
56
30
46
26
17
10
2
Value
46
29
38
25
19
10
2
Electrical Characteristics
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 2, 3
1, 2, 3
1, 3
1, 3
1, 4
1, 5
1, 6
Notes
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 3
1, 4
1, 5
11