MCIMX31LVKN5 Freescale Semiconductor, MCIMX31LVKN5 Datasheet - Page 11

• Manufacturer Part Number: MCIMX31LVKN5
• Description: IC MPU MAP I.MX31L 457-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX31r

Specifications of MCIMX31LVKN5

• Core Processor: ARM11
• Core Size: 32-Bit
• Speed: 532MHz
• Connectivity: 1-Wire, ATA, EBI/EMI, FIR, I²C, MMC/SD, PCMCIA, SIM, SPI, SSI, UART/USART, USB, USB OTG
• Peripherals: DMA, LCD, POR, PWM, WDT
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.22 V ~ 3.3 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 457-MAPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Table 6
Table 7
Freescale Semiconductor
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case (Top)
Junction to Package Top (natural convection)
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
5. Thermal resistance between the die and the case top surface as measured by the cold plate method
6. Thermal characterization parameter indicating the temperature difference between package top
Junction to Ambient (natural convection)
Junction to Ambient (natural convection)
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top (natural convection)
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of
other components on the board, and board thermal resistance.
specification.
temperature is measured on the top surface of the board near the package.
(MIL SPEC-883 Method 1012.1).
and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the
thermal characterization parameter is written as Psi-JT.
provides the thermal resistance data for the 14 × 14 mm, 0.5 mm pitch package.
provides the thermal resistance data for the 19 × 19 mm, 0.8 mm pitch package.
Rating
Rating
Table 6. Thermal Resistance Data—14
Table 7. Thermal Resistance Data—19
MCIMX31/MCIMX31L Technical Data, Rev. 4.1
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
NOTES
Board
—
—
—
Board
—
—
—
×
×
14 mm Package
19 mm Package
Symbol
Symbol
R
R
R
R
R
R
R
R
R
R
R
R
Ψ
θJCtop
Ψ
θJMA
θJMA
θJMA
θJMA
θJC
θJA
θJA
θJB
θJA
θJA
θJB
JT
JT
Value
56
30
46
26
17
10
2
Value
46
29
38
25
19
10
2
Electrical Characteristics
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 2, 3
1, 2, 3
1, 3
1, 3
1, 4
1, 5
1, 6
Notes
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 3
1, 4
1, 5
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