MCF5214CVF66 Freescale Semiconductor, MCF5214CVF66 Datasheet - Page 683

• Manufacturer Part Number: MCF5214CVF66
• Description: IC MPU 32BIT COLDF 256-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF521xr

Specifications of MCF5214CVF66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 142
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Package: 256MA-BGA
• Device Core: ColdFire
• Family Name: MCF521x
• Maximum Speed: 66 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 32 Bit
• Number Of Programmable I/os: 142
• Interface Type: QSPI/UART/I2C/CAN
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 8
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

32.2
Freescale Semiconductor
MCF5214CVF66
MCF5216CVF66
MCF5280CVF66
MCF5280CVF80
MCF5281CVF66
MCF5281CVF80
MCF5282CVF66
MCF5282CVF80
15X
Freescale Part
e
Number
Y
E
Ordering Information
S
X
0.20
16
15
14
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
13
12
11
VIEW M-M
10
D
MCF5216 RISC Microprocessor
MCF5280 RISC Microprocessor
MCF5281 RISC Microprocessor
MCF5282 RISC Microprocessor
MCF5282 and MCF5216 ColdFire Microcontroller User’s Manual, Rev. 3
MCF5214 RISC Microprocessor
MCF5280 RISC Microprocessor
MCF5281 RISC Microprocessor
MCF5282 RISC Microprocessor
7
6
5
15X
S
Figure 32-3. 256 MAPBGA Package Dimensions
4
3
e
2
Description
1
Table 32-2. Orderable Part Numbers
M
G
H
K
A
B
C
D
E
F
L
N
P
R
T
J
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
K
256X
M
M
0.25
0.10
b
3
M
M
Z
Z
X
Y
A
A2
256 MAPBGA
256 MAPBGA
256 MAPBGA
256 MAPBGA
256 MAPBGA
256 MAPBGA
256 MAPBGA
256 MAPBGA
A1
Package
Z
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
4
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DETAIL K
DIM Min
66.67 MHz
66.67 MHz
66.67 MHz
66.67 MHz
66.67 MHz
A1 0.27
A2
A
D
E
S
b
e
80 MHz
80 MHz
80 MHz
Speed
°
1.25
0.40
Millimeters
17.00 BSC
17.00 BSC
1.00 BSC
0.50 BSC
256X
1.16 REF
0.15
1.60
0.47
0.60
Max
Z
-40
-40
-40
-40
-40
-40
-40
-40
Temperature
°
°
°
°
°
°
°
°
Mechanical Data
to +85
to +85
to +85
to +85
to +85
to +85
to +85
to +85
0.30
5
Z
°
°
°
°
°
°
°
°
C
C
C
C
C
C
C
C
32-9