W90N740CDG Nuvoton Technology Corporation of America, W90N740CDG Datasheet - Page 56

no-image

W90N740CDG

Manufacturer Part Number
W90N740CDG
Description
IC MCU ARM7 TDMI 176-LQFP
Manufacturer
Nuvoton Technology Corporation of America
Series
W90r
Datasheet

Specifications of W90N740CDG

Core Processor
ARM7
Core Size
16/32-Bit
Speed
80MHz
Connectivity
EBI/EMI, Ethernet, UART/USART, USB
Peripherals
DMA, POR, WDT
Number Of I /o
21
Program Memory Type
ROMless
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
176-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
W90N740CDG
Manufacturer:
Winbond
Quantity:
1 000
Part Number:
W90N740CDG
Manufacturer:
Winbond
Quantity:
9 470
Part Number:
W90N740CDG
Manufacturer:
Winbond
Quantity:
12 388
Part Number:
W90N740CDG
Manufacturer:
NUVOTON30
Quantity:
60
Part Number:
W90N740CDG
Manufacturer:
WINBOND
Quantity:
3 546
Part Number:
W90N740CDG
Manufacturer:
Nuvoton Technology Corporation of America
Quantity:
10 000
Part Number:
W90N740CDG
Manufacturer:
WINBOND/华邦
Quantity:
20 000
Company:
Part Number:
W90N740CDG
Quantity:
130
tACS [7:5] :Address set-up before nECS for external I/O bank 0~3
tCOS [4:2]:Chip selection set-up time on nOE or nWBE for external I/O bank 0~3
When ROM/Flash memory bank is configured, the access to its bank stretches chip selection time before
the nOE or new signal is activated.
DBWD [1:0] :Programmable data bus width for external I/O bank 0~3
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
DBWD [1:0]
tCOS [4:2]
tACS [7:5]
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
- 53 -
W90N740CD/W90N740CDG
WIDTH OF DATA BUS
Publication Release Date: Aug. 18, 2005
Disable bus
16-bit
32-bit
8-bit
MCLK
MCLK
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Revision A6

Related parts for W90N740CDG