DF2166VTE33 Renesas Electronics America, DF2166VTE33 Datasheet - Page 790

MCU FLASH 3V 512K 33MHZ 144TQFP

DF2166VTE33

Manufacturer Part Number
DF2166VTE33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
23.12
Usage Notes
23.12.1 I/O Port Status
The status of the I/O ports is retained in software standby mode. Therefore, when a high level is
output, the current consumption is not reduced by the amount of current to support the high level
output.
23.12.2 Current Consumption when Waiting for Oscillation Settling
The current consumption increases during oscillation settling.
23.12.3 DTC Module Stop Mode
If the DTC module stop mode specification and DTC bus request occur simultaneously, the bus is
released to the DTC and the MSTP bit cannot be set to 1. After completing the DTC bus cycle, set
the MSTP bit to 1 again.
23.12.4 Notes on Subclock Usage
When using the subclock, make a transition to power-down mode after setting the EXCLE bit in
LPWRCR to 1 and loading the subclock two or more cycles. When not using the sublock, the
EXCLE bit should not be set to 1.
Rev. 3.00, 03/04, page 748 of 830

Related parts for DF2166VTE33