DF2166VTE33 Renesas Electronics America, DF2166VTE33 Datasheet - Page 657

MCU FLASH 3V 512K 33MHZ 144TQFP

DF2166VTE33

Manufacturer Part Number
DF2166VTE33
Description
MCU FLASH 3V 512K 33MHZ 144TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VTE33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
20.1.3
This LSI’s flash memory is configured by the 8-kbyte user boot MAT and 256-kbyte (H8S/2168),
384-kbyte (H8S/2167), or 512-kbytes (H8S/2166) user MAT.
The start address is allocated to the same address in the user MAT and user boot MAT. Therefore,
when the program execution or data access is performed between two MATs, the MAT must be
switched by using FMATS.
The user MAT or user boot MAT can be read in all modes. However, the user boot MAT can be
programmed only in boot mode and programmer mode.
The size of the user MAT is different from that of the user boot MAT. An address which exceeds
the size of the 8-kbyte user boot MAT should not be accessed. If the attempt is made, data is read
as undefined value.
Address H'07FFFF
Address H'000000
Address H'03FFFF
Address H'05FFFF
Flash Memory MAT Configuration
<User MAT>
Figure 20.3 Flash Memory Configuration
256 kbytes
(H8S/2168)
384 kbytes
(H8S/2167)
512 kbytes
(H8S/2166)
Address H'001FFF
Address H'000000
Rev. 3.00, 03/04, page 615 of 830
<User Boot MAT>
8 kbytes

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