R4F24568NVRFQV Renesas Electronics America, R4F24568NVRFQV Datasheet - Page 284

• Manufacturer Part Number: R4F24568NVRFQV
• Description: MCU 256KB FLASH 48K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24568NVRFQV

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 32MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
(2)
When DRAM space is accessed in DMAC or EXDMAC single address transfer mode, full access
(normal access) is always performed. With the DRAM interface, the DACK or EDACK output
goes low from the T
In modes other than DMAC or EXDMAC single address transfer mode, burst access can be used
when accessing DRAM space.
Figure 6.54 shows the DACK or EDACK output timing for the DRAM interface when DDS = 0 or
EDDS = 0.
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Read
Write
Note: n = 2 to 5
Figure 6.54 Example of DACK/EDACK Output Timing when DDS = 0 or EDDS = 0
When DDS = 0 or EDDS = 0
DACK or EDACK
φ
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
r
state.
T
p
Row address
(RAST = 0, CAST = 1)
High
High
T
r
T
c1
Column address
H8S/2456, H8S/2456R, H8S/2454 Group
T
c2
REJ09B0467-0350 Rev. 3.50
T
c3
Jul 07, 2010