MC9S08SH16MTG Freescale Semiconductor, MC9S08SH16MTG Datasheet - Page 16

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MC9S08SH16MTG

Manufacturer Part Number
MC9S08SH16MTG
Description
MCU 8BIT 16K FLASH 16-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08SH16MTG

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
16-TSSOP
Core
S08
Processor Series
MC9S08Sxx
Data Bus Width
8 bit
Maximum Clock Frequency
40 MHz
Data Ram Size
1 KB
On-chip Adc
Yes
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Operating Temperature Range
- 40 C to + 125 C
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
8
Height
1.05 mm
Interface Type
SCI, SPI, I2C
Length
5 mm
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Width
4.4 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Section Number
15.5 Functional Description .................................................................................................................. 234
16.1 Introduction ................................................................................................................................... 239
16.2 Signal Description ......................................................................................................................... 244
16.3 Register Definition ........................................................................................................................ 248
16.4 Functional Description .................................................................................................................. 254
16.5 Reset Overview ............................................................................................................................. 260
16.6 Interrupts ....................................................................................................................................... 260
16.7 The Differences from TPM v2 to TPM v3.................................................................................... 262
17.1 Introduction ................................................................................................................................... 265
17.2 Background Debug Controller (BDC) .......................................................................................... 266
16
15.4.3 SPI Baud Rate Register (SPIxBR).................................................................................. 231
15.4.4 SPI Status Register (SPIxS) ............................................................................................ 232
15.4.5 SPI Data Register (SPIxD).............................................................................................. 233
15.5.1 SPI Clock Formats .......................................................................................................... 234
15.5.2 SPI Interrupts .................................................................................................................. 237
15.5.3 Mode Fault Detection ..................................................................................................... 237
16.1.1 TPM Configuration Information ..................................................................................... 239
16.1.2 TPM Pin Repositioning .................................................................................................. 239
16.1.3 Features ........................................................................................................................... 241
16.1.4 Modes of Operation ........................................................................................................ 241
16.1.5 Block Diagram ................................................................................................................ 242
16.2.1 Detailed Signal Descriptions........................................................................................... 244
16.3.1 TPM Status and Control Register (TPMxSC) ................................................................ 248
16.3.2 TPM-Counter Registers (TPMxCNTH:TPMxCNTL).................................................... 249
16.3.3 TPM Counter Modulo Registers (TPMxMODH:TPMxMODL).................................... 250
16.3.4 TPM Channel n Status and Control Register (TPMxCnSC) .......................................... 251
16.3.5 TPM Channel Value Registers (TPMxCnVH:TPMxCnVL) .......................................... 253
16.4.1 Counter............................................................................................................................ 255
16.4.2 Channel Mode Selection ................................................................................................. 257
16.5.1 General............................................................................................................................ 260
16.5.2 Description of Reset Operation....................................................................................... 260
16.6.1 General............................................................................................................................ 260
16.6.2 Description of Interrupt Operation.................................................................................. 261
17.1.1 Forcing Active Background ............................................................................................ 265
17.1.2 Features ........................................................................................................................... 266
17.2.1 BKGD Pin Description ................................................................................................... 267
Timer Pulse-Width Modulator (S08TPMV3)
MC9S08SH32 Series Data Sheet, Rev. 2
Development Support
Chapter 16
Chapter 17
PRELIMINARY
Title
Freescale Semiconductor
Page

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