AT32UC3A1512-AUR Atmel, AT32UC3A1512-AUR Datasheet - Page 410

• Manufacturer Part Number: AT32UC3A1512-AUR
• Description: MCU 32BIT 512KB FLASH 100-TQFP
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3A1512-AUR

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: Ethernet, I²C, SPI, SSC, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMR770-1008 - ISP 4PORT ATMEL AVR32 MCU SPIATSTK600-TQFP100 - STK600 SOCKET/ADAPTER 100-TQFPATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

28. SDRAM Controller (SDRAMC)
28.1
28.2
32058J–AVR32–04/11
Features
Description
Rev: 2.0.1.1
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The SDRAM Controller (SDRAMC) extends the memory capabilities of a chip by providing the
interface to an external 16-bit or 32-bit SDRAM device. The page size supports ranges from
2048 to 8192 and the number of columns from 256 to 2048. It supports byte (8-bit), half-word
(16-bit) and word (32-bit) accesses.
The SDRAM Controller supports a read or write burst length of one location. It keeps track of the
active row in each bank, thus maximizing SDRAM performance, e.g., the application may be
placed in one bank and data in the other banks. So as to optimize performance, it is advisable to
avoid accessing different rows in the same bank.
The SDRAM controller supports a CAS latency of 1, 2 or 3 and optimizes the read access
depending on the frequency.
The different modes available - self-refresh, power-down and deep power-down modes - mini-
mize power consumption on the SDRAM device.
Numerous Configurations Supported
Programming Facilities
Energy-saving Capabilities
Error Detection
SDRAM Power-up Initialization by Software
CAS Latency of 1, 2, 3 Supported
Auto Precharge Command Not Used
– 2K, 4K, 8K Row Address Memory Parts
– SDRAM with Two or Four Internal Banks
– SDRAM with 16- or 32-bit Data Path
– Word, Half-word, Byte Access
– Automatic Page Break When Memory Boundary Has Been Reached
– Multibank Ping-pong Access
– Timing Parameters Specified by Software
– Automatic Refresh Operation, Refresh Rate is Programmable
– Automatic Update of DS, TCR and PASR Parameters (Mobile SDRAM Devices)
– Self-refresh, Power-down and Deep Power Modes Supported
– Supports Mobile SDRAM Devices
– Refresh Error Interrupt
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