PIC16F526-I/P Microchip Technology, PIC16F526-I/P Datasheet - Page 86

IC PIC MCU FLASH 1KX12 14DIP

PIC16F526-I/P

Manufacturer Part Number
PIC16F526-I/P
Description
IC PIC MCU FLASH 1KX12 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets

Specifications of PIC16F526-I/P

Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
67 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 3x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
67 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162096 - HEADER MPLAB ICD2 PIC16F526 8/14
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16F526
14.2
DS41326E-page 86
DC Characteristics
D001
D002
D003
D004
D005
D010
D020
D022
D023
D022
D023
D024
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25C. This data is for design
Param
No.
*
2: This is the limit to which V
3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
4: The test conditions for all I
5: For standby current measurements, the conditions are the same as I
6: For EXTRC mode, does not include current through R
DC Characteristics: PIC16F526 (Extended)
V
V
V
S
I
I
I
I
ICMP
Ic
I
I
These parameters are characterized but not tested.
guidance only and is not tested.
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
V
mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep.
by the formula:
I = V
DDP
DD
PD
WDT
FVR
Sym.
DD
DR
POR
VDD
VREF
DD
AD
*
; WDT enabled/disabled as specified.
DD
/2R
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current During Prog/
Erase
Supply Current
Power-down Current
WDT Current
Comparator Current
Cv
Internal 0.6V Fixed Voltage
Reference Current
A/D Conversion Current
DD
DD
EXT
REF
Start Voltage to ensure
Rise Rate to ensure
(mA) with R
Current
Characteristic
(5)
(5)
(3,4,6)
DD
DD
EXT
(5)
can be lowered in Sleep mode without losing RAM data.
measurements in Active Operation mode are:
(5)
(5)
in k.
(2)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40C  T
0.05*
Min.
2.0
Typ.
250*
0.75
0.35
1.5*
Vss
175
400
250
100
175
120
200
1.4
0.1
1.0
7.0
11
38
15
60
30
75
EXT
(1)
. The current through the resistor can be estimated
Max.
15.0
150
250
250
700
400
110
135
130
220
5.5
1.2
2.2
9.0
26
18
22
26
76
75
Units
V/ms
mA
mA
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
DD
V
V
V
, except that the device is in Sleep
See Figure 14-1
Device in Sleep mode
See Section 8.4 “Power-on
Reset (POR)” for details
See Section 8.4 “Power-on
Reset (POR)” for details
F
F
F
F
F
F
F
V
V
V
V
V
V
V
V
V
comparator enabled)
V
comparator enabled)
2.0V
5.0V
OSC
OSC
OSC
OSC
OSC
OSC
OSC
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
A
 2010 Microchip Technology Inc.
 +125C (extended)
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V (per comparator)
= 5.0V (per comparator)
= 2.0V (high range)
= 5.0V (high range)
= 2.0V (reference and 1
= 5.0V (reference and 1
SS
= 4 MHz, V
= 4 MHz, V
= 8 MHz, V
= 8 MHz, V
= 20 MHz, V
= 32 kHz, V
= 32 kHz, V
, T0CKI = V
Conditions
DD
DD
DD
DD
DD
DD
DD
DD
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V
= 5.0V
, MCLR =
= 5.0V

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