SAF-XE167G-72F66L AC Infineon Technologies, SAF-XE167G-72F66L AC Datasheet - Page 41
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SAF-XE167G-72F66L AC
Manufacturer Part Number
SAF-XE167G-72F66L AC
Description
IC MCU 16BIT FLASH PG-LQFP-144
Manufacturer
Infineon Technologies
Series
XE16xr
Datasheet
1.SAF-XE167K-96F66L_AC.pdf
(122 pages)
Specifications of SAF-XE167G-72F66L AC
Core Processor
C166SV2
Core Size
16-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, I²C, LIN, SPI, SSC, UART/USART, USI
Peripherals
I²S, POR, PWM, WDT
Number Of I /o
118
Program Memory Size
576KB (576K x 8)
Program Memory Type
FLASH
Ram Size
50K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LFQFP
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN
Maximum Clock Frequency
66 MHz
Number Of Programmable I/os
118
Number Of Timers
11
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
FXE167G72F66LACXP
SAF-XE167G-72F66LACIN
SP000363815
SAF-XE167G-72F66LACIN
SP000363815
XE167x
XE166 Family Derivatives
Functional Description
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word-wide registers which are
used to control and monitor functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XE166 Family. In order to to ensure
upward compatibility they should either not be accessed or written with zeros.
In order to meet the requirements of designs where more memory is required than is
available on chip, up to 12 Mbytes (approximately, see
Table
5) of external RAM and/or
ROM can be connected to the microcontroller. The External Bus Interface also provides
access to external peripherals.
Up to 768 Kbytes of on-chip Flash memory store code, constant data, and control
data. The on-chip Flash memory consists of up to three modules with a maximum
capacity of 256 Kbytes each. Each module is organized in 4-Kbyte sectors.
The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used
internally to store operation control parameters and protection information.
Note: The actual size of the Flash memory depends on the chosen derivative (see
Table
1).
1)
Each sector can be separately write protected
, erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A user-defined password
sequence temporarily unlocks protected areas. The Flash modules combine 128-bit
read access with protected and efficient writing algorithms for programming and erasing.
Dynamic error correction provides extremely high read data security for all read access
operations. Access to different Flash modules can be executed in parallel.
For Flash parameters, please see
Section
4.5.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for
programming/erasing.
Data Sheet
39
V2.1, 2008-08