MC56F8322MFAE Freescale Semiconductor, MC56F8322MFAE Datasheet - Page 6

• Manufacturer Part Number: MC56F8322MFAE
• Description: IC DSP 16BIT 60MHZ 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8322MFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 21
• Program Memory Size: 40KB (20K x 16)
• Program Memory Type: FLASH
• Ram Size: 6K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 48-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 21
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.75/3.6V
• Operating Supply Voltage (min): 2.25/3V
• On-chip Adc: 2(3-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 4 KB
• Operating Supply Voltage: - 0.3 V to + 4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Rom Size: 8 KB
• Minimum Operating Temperature: - 40 C
• For Use With: MC56F8323EVME - BOARD EVALUATION MC56F8323
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

6
Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . 7
Part 2: Signal/Connection Descriptions . . 16
Part 3: On-Chip Clock Synthesis (OCCS) . 28
Part 4: Memory Map . . . . . . . . . . . . . . . . . . 32
Part 5: Interrupt Controller (ITCN) . . . . . . . 54
Part 6: System Integration Module (SIM) . . 79
Part 7: Security Features . . . . . . . . . . . . . . 95
1.1. 56F8322/56F8122 Features . . . . . . . . . . . . . 7
1.2. Device Description . . . . . . . . . . . . . . . . . . . . 9
1.3. Award-Winning Development Environment 10
1.4. Architecture Block Diagram . . . . . . . . . . . . . 11
1.5. Product Documentation . . . . . . . . . . . . . . . 15
1.6. Data Sheet Conventions . . . . . . . . . . . . . . . 15
2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.2. Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.2. External Clock Operation . . . . . . . . . . . . . . 28
3.3. Use of On-Chip Relaxation Oscillator . . . . . 30
3.4. Internal Clock Operation . . . . . . . . . . . . . . . 30
3.5. Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.2. Program Map . . . . . . . . . . . . . . . . . . . . . . . . 32
4.3. Interrupt Vector Table . . . . . . . . . . . . . . . . . 33
4.4. Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.5. Flash Memory Map . . . . . . . . . . . . . . . . . . . 36
4.6. EOnCE Memory Map . . . . . . . . . . . . . . . . . 38
4.7. Peripheral Memory Mapped Registers . . . . 38
4.8. Factory-Programmed Memory . . . . . . . . . . 54
5.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.2. Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.3. Functional Description . . . . . . . . . . . . . . . . 54
5.4. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 56
5.5. Operating Modes . . . . . . . . . . . . . . . . . . . . 56
5.6. Register Descriptions . . . . . . . . . . . . . . . . . 57
5.7. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
6.3. Operating Modes . . . . . . . . . . . . . . . . . . . . . 80
6.4. Operating Mode Register. . . . . . . . . . . . . . . 81
6.5. Register Descriptions. . . . . . . . . . . . . . . . . . 81
6.6. Clock Generation Overview . . . . . . . . . . . . . 93
6.7. Power-Down Modes. . . . . . . . . . . . . . . . . . . 93
6.8. Stop and Wait Mode Disable Function . . . . 94
6.9. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
7.1. Operation with Security Enabled . . . . . . . . . 95
7.2. Flash Access Blocking Mechanisms . . . . . . 95
56F8322 Techncial Data, Rev. 16
Table of Contents
Part 8: General Purpose Input/Output
Part 9: Joint Test Action Group (JTAG) . . 100
Part 10: Specifications . . . . . . . . . . . . . . . . 101
Part 11: Packaging . . . . . . . . . . . . . . . . . . 126
Part 12: Design Considerations . . . . . . . . 131
Part 13: Ordering Information . . . . . . . . . 134
8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 98
8.2. Configuration . . . . . . . . . . . . . . . . . . . . . . . . 98
8.3. Memory Maps . . . . . . . . . . . . . . . . . . . . . . .100
9.1. JTAG Information . . . . . . . . . . . . . . . . . . . 100
10.1. General Characteristics . . . . . . . . . . . . . .101
10.2. DC Electrical Characteristics . . . . . . . . . .105
10.3. AC Electrical Characteristics . . . . . . . . . .109
10.4. Flash Memory Characteristics . . . . . . . . . 110
10.5. External Clock Operation Timing . . . . . . .111
10.6. Phase Locked Loop Timing . . . . . . . . . . . 111
10.7. Oscillator Parameters . . . . . . . . . . . . . . . 112
10.8. Reset, Stop, Wait, Mode Select,
10.9. Serial Peripheral Interface (SPI) Timing . .115
10.10. Quad Timer Timing . . . . . . . . . . . . . . . . .118
10.11. Quadrature Decoder Timing . . . . . . . . . .118
10.12. Serial Communication Interface
10.13. Controller Area Network (CAN) Timing .120
10.14. JTAG Timing . . . . . . . . . . . . . . . . . . . . . .120
10.15. Analog-to-Digital Converter
10.16. Equivalent Circuit for ADC Inputs . . . . . .124
10.17. Power Consumption . . . . . . . . . . . . . . . 124
11.1. 56F8322 Package and
11.2. 56F8122 Package and Pin-Out
12.1. Thermal Design Considerations . . . . . . . 131
12.2. Electrical Design Considerations . . . . . . .132
12.3. Power Distribution and I/O Ring
(GPIO) . . . . . . . . . . . . . . . . . . . . . . . . 98
and Interrupt Timing . . . . . . . . . . 113
(SCI) Timing . . . . . . . . . . . . . . . . .119
(ADC) Parameters . . . . . . . . . . . .121
Pin-Out Information . . . . . . . . . . .126
Information . . . . . . . . . . . . . . . . . 128
Implementation . . . . . . . . . . . . . .133
Freescale Semiconductor
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