C8051F996-GM Silicon Laboratories Inc, C8051F996-GM Datasheet - Page 188
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C8051F996-GM
Manufacturer Part Number
C8051F996-GM
Description
IC MCU 8BIT 8KB FLASH 24QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F9xxr
Specifications of C8051F996-GM
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
24-UQFN Exposed Pad, 24-HUQFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Cap Sense, POR, PWM, Temp Sensor, WDT
Number Of I /o
17
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F9x
Core
8051
Data Ram Size
512 B
Interface Type
I2C, SMBus, Enhanced UART, Enhanced SPI
Maximum Clock Frequency
7 KHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.4 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F996DK
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
On-chip Dac
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1943-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F996-GM
Manufacturer:
SILICON
Quantity:
570
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C8051F99x-C8051F98x
Important Note on External Crystals: Crystal oscillator circuits are quite sensitive to PCB layout. The
crystal should be placed as close as possible to the XTAL pins on the device. The traces should be as
short as possible and shielded with ground plane from any other traces which could introduce noise or
interference.
When using an external crystal, the external oscillator drive circuit must be configured by software for Crys-
tal Oscillator Mode or Crystal Oscillator Mode with divide by 2 stage. The divide by 2 stage ensures that the
clock derived from the external oscillator has a duty cycle of 50%. The External Oscillator Frequency Con-
trol value (XFCN) must also be specified based on the crystal frequency. The selection should be based on
Table 19.1. For example, a 25 MHz crystal requires an XFCN setting of 111b.
When the crystal oscillator is first enabled, the external oscillator valid detector allows software to deter-
mine when the external system clock has stabilized. Switching to the external oscillator before the crystal
oscillator has stabilized can result in unpredictable behavior. The recommended procedure for starting the
crystal is as follows:
1. Configure XTAL1 and XTAL2 for analog I/O and disable the digital output drivers.
2. Configure and enable the external oscillator.
3. Poll for XTLVLD => 1.
4. Switch the system clock to the external oscillator.
188
XFCN
000
001
010
100
101
011
110
111
Table 19.1. Recommended XFCN Settings for Crystal Mode
155 kHz f 415 kHz
415 kHz f 1.1 MHz
1.1 MHz f 3.1 MHz
3.1 MHz f 8.2 MHz
8.2 MHz f 25 MHz
58 kHz f 155 kHz
20 kHz f 58 kHz
Crystal Frequency
Figure 19.2. 25 MHz External Crystal Example
f 20 kHz
25 MHz
15 pF
15 pF
Rev. 1.0
Bias Current
10 Mohm
120 µA
550 µA
2.6 mA
0.5 µA
1.5 µA
4.8 µA
14 µA
40 µA
XTAL1
XTAL2
Typical Supply Current
3.0 µA, f = 32.768 kHz
4.8 µA, f = 32.768 kHz
9.6 µA, f = 32.768 kHz
193 µA, f = 400 kHz
3.9 mA, f = 25 MHz
28 µA, f = 400 kHz
71 µA, f = 400 kHz
940 µA, f = 8 MHz
(VDD = 2.4 V)
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