C8051F996-GM Silicon Laboratories Inc, C8051F996-GM Datasheet - Page 187
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C8051F996-GM
Manufacturer Part Number
C8051F996-GM
Description
IC MCU 8BIT 8KB FLASH 24QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F9xxr
Specifications of C8051F996-GM
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
24-UQFN Exposed Pad, 24-HUQFN
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Cap Sense, POR, PWM, Temp Sensor, WDT
Number Of I /o
17
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F9x
Core
8051
Data Ram Size
512 B
Interface Type
I2C, SMBus, Enhanced UART, Enhanced SPI
Maximum Clock Frequency
7 KHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.4 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F996DK
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
On-chip Dac
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1943-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F996-GM
Manufacturer:
SILICON
Quantity:
570
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C8051F99x-C8051F98x
19.1. Programmable Precision Internal Oscillator
All C8051F99x-C8051F98x devices include a programmable precision internal oscillator that may be
selected as the system clock. OSCICL is factory calibrated to obtain a 24.5 MHz frequency. See Section
“4. Electrical Characteristics” on page 46 for complete oscillator specifications.
The precision oscillator supports a spread spectrum mode which modulates the output frequency in order
to reduce the EMI generated by the system. When enabled (SSE = 1), the oscillator output frequency is
modulated by a stepped triangle wave whose frequency is equal to the oscillator frequency divided by 384
(63.8 kHz using the factory calibration). The deviation from the nominal oscillator frequency is +0%, –1.6%,
and the step size is typically 0.26% of the nominal frequency. When using this mode, the typical average
oscillator frequency is lowered from 24.5 MHz to 24.3 MHz.
19.2. Low Power Internal Oscillator
All C8051F99x-C8051F98x devices include a low power internal oscillator that defaults as the system
clock after a system reset. The low power internal oscillator frequency is 20 MHz ± 10% and is automati-
cally enabled when selected as the system clock and disabled when not in use. See Section “4. Electrical
Characteristics” on page 46 for complete oscillator specifications.
19.3. External Oscillator Drive Circuit
All C8051F99x-C8051F98x devices include an external oscillator circuit that may drive an external crystal,
ceramic resonator, capacitor, or RC network. A CMOS clock may also provide a clock input. Figure 19.1
shows a block diagram of the four external oscillator options. The external oscillator is enabled and config-
ured using the OSCXCN register.
The external oscillator output may be selected as the system clock or used to clock some of the digital
peripherals (e.g., Timers, PCA, etc.). See the data sheet chapters for each digital peripheral for details.
See Section “4. Electrical Characteristics” on page 46 for complete oscillator specifications.
19.3.1. External Crystal Mode
If a crystal or ceramic resonator is used as the external oscillator, the crystal/resonator and a 10 Mresis-
tor must be wired across the XTAL1 and XTAL2 pins as shown in Figure 19.1, Option 1. Appropriate load-
ing capacitors should be added to XTAL1 and XTAL2, and both pins should be configured for analog I/O
with the digital output drivers disabled.
Figure 19.2 shows the external oscillator circuit for a 20 MHz quartz crystal with a manufacturer recom-
mended load capacitance of 12.5 pF. Loading capacitors are "in series" as seen by the crystal and "in par-
allel" with the stray capacitance of the XTAL1 and XTAL2 pins. The total value of the each loading
capacitor and the stray capacitance of each XTAL pin should equal 12.5 pF x 2 = 25 pF. With a stray
capacitance of 10 pF per pin, the 15 pF capacitors yield an equivalent series capacitance of 12.5 pF
across the crystal.
Note: The recommended load capacitance depends upon the crystal and the manufacturer. Please refer to the crystal
data sheet when completing these calculations.
Rev. 1.0
187
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