ADZS-21262-1-EZEXT Analog Devices Inc, ADZS-21262-1-EZEXT Datasheet - Page 2

• Manufacturer Part Number: ADZS-21262-1-EZEXT
• Description: BOARD DAUGHTER FOR ADSP-21262
• Manufacturer: Analog Devices Inc

Specifications of ADZS-21262-1-EZEXT

• Accessory Type: DSP
• Silicon Manufacturer: Analog Devices
• Core Architecture: SHARC
• Features: Expansion Interface, High Speed Converter (HSC) Interface
• Kit Contents: Board Docs
• Silicon Family Name: SHARC
• Silicon Core Number: ADSP-21262
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: ADSP-21262
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
TABLE OF CONTENTS
Summary ............................................................... 1
Dedicated Audio Components .................................... 1
Revision History ...................................................... 2
General Description ................................................. 3
Pin Function Descriptions ....................................... 11
Specifications ........................................................ 14
REVISION HISTORY
3/11—Rev. F to Rev. G
Revised
Revised
LQFP_EP Pin Configurations .................................... 46
Added an additional model to
SHARC Family Core Architecture ............................ 4
Family Peripheral Architecture ................................ 6
I/O Processor Features ........................................... 8
System Design ...................................................... 8
Development Tools ............................................... 9
Additional Information ........................................ 10
Related Signal Chains .......................................... 10
Operating Conditions .......................................... 14
Electrical Characteristics ....................................... 14
S/PDIF Transmitter Input Data Timing ............. 38
Table
45, added
Figure 43
Automotive Products ....... 53
and
Figure 44
in
144-Lead
Rev. G | Page 2 of 56 | March 2011
144-Lead LQFP_EP Pin Configurations ....................... 46
136-Ball BGA Pin Configurations ............................... 48
Package Dimensions ............................................... 51
Automotive Products .............................................. 53
Ordering Guide ..................................................... 54
Package Information ............................................ 15
ESD Caution ...................................................... 15
Maximum Power Dissipation ................................. 15
Absolute Maximum Ratings ................................... 15
Timing Specifications ........................................... 15
Output Drive Currents ......................................... 44
Test Conditions .................................................. 44
Capacitive Loading .............................................. 44
Thermal Characteristics ........................................ 45
Surface-Mount Design .......................................... 52