ADZS-21262-1-EZEXT Analog Devices Inc, ADZS-21262-1-EZEXT Datasheet - Page 14

• Manufacturer Part Number: ADZS-21262-1-EZEXT
• Description: BOARD DAUGHTER FOR ADSP-21262
• Manufacturer: Analog Devices Inc

Specifications of ADZS-21262-1-EZEXT

• Accessory Type: DSP
• Silicon Manufacturer: Analog Devices
• Core Architecture: SHARC
• Features: Expansion Interface, High Speed Converter (HSC) Interface
• Kit Contents: Board Docs
• Silicon Family Name: SHARC
• Silicon Core Number: ADSP-21262
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: ADSP-21262
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPECIFICATIONS
Specifications are subject to change without notice.
OPERATING CONDITIONS
1
2
3
4
ELECTRICAL CHARACTERISTICS
1
2
3
4
5
6
7
8
9
10
11
Applies to input and bidirectional pins: AD15–0, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, SPIDS, BOOT_CFGx, CLK_CFGx, RESET, TCK, TMS, TDI, and TRST.
Applies to input pin CLKIN.
See ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 for information on thermal specifications.
See Estimating Power for the ADSP-21362 SHARC Processors (EE-277) for further information.
Applies to output and bidirectional pins: AD15–0, RD, WR, ALE, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, EMU, TDO, and XTAL.
See
Applies to input pins: SPIDS, BOOT_CFGx, CLK_CFGx, TCK, RESET, and CLKIN.
Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI.
Applies to three-stateable pins: FLAG3–0.
Applies to three-stateable pins with 22.5 kΩ pull-ups: AD15–0, DAI_Px, SPICLK, EMU, MISO, and MOSI.
Typical internal current data reflects nominal operating conditions.
See Estimating Power for the ADSP-21362 SHARC Processors (EE-277) for further information.
Characterized, but not tested.
Applies to all signal pins.
Guaranteed, but not tested.
Parameter
V
A
V
V
V
V
V
T
T
Parameter
V
V
I
I
I
I
I
I
I
IA
C
IH
IL
ILPU
OZH
OZL
OZLPU
DD-INTYP
J
J
DDINT
DDEXT
IH
IL
IH_CLKIN
IL_CLKIN
OH
OL
IN
VDD
3, 4
3, 4
3
VDD
3, 4
Output Drive Currents on Page 44
1
1
10, 11
1
5
1
4
5, 6
9
6
7, 8
2
Description
Internal (Core) Supply Voltage
Analog (PLL) Supply Voltage
External (I/O) Supply Voltage
High Level Input Voltage @ V
Low Level Input Voltage @ V
High Level Input Voltage @ V
Low Level Input Voltage @ V
Junction Temperature 136-Ball CSP_BGA
Junction Temperature 144-Lead LQFP_EP
Description
High Level Output Voltage
Low Level Output Voltage
High Level Input Current
Low Level Input Current
Low Level Input Current Pull-Up
Three-State Leakage Current
Three-State Leakage Current
Three-State Leakage Current Pull-Up
Supply Current (Internal)
Supply Current (Analog)
Input Capacitance
for typical drive current capabilities.
DDEXT
DDEXT
DDEXT
DDEXT
= Min
= Min
= Max
= Max
Rev. G | Page 14 of 56 | March 2011
Min
1.14
1.14
3.13
2.0
–0.5
1.74
–0.5
0
0
Test Conditions
@ V
@ V
@ V
@ V
@ V
@ V
@ V
@ V
t
A
f
IN
CCLK
VDD
= 1 MHz, T
K Grade
DDEXT
DDEXT
DDEXT
DDEXT
DDEXT
DDEXT
DDEXT
DDEXT
Max
1.26
1.26
3.47
V
+0.8
V
+1.19
+110
+110
= Min, V
DDEXT
DDEXT
= Max
= Min, I
= Min, I
= Max, V
= Max, V
= Max, V
= Max, V
= Max, V
= Max, V
+ 0.5
+ 0.5
CASE
DDINT
OH
OL
= 25°C, V
IN
IN
IN
IN
IN
IN
= Nom
= 1.0 mA
= –1.0 mA
= V
= 0 V
= 0 V
= 0 V
= 0 V
= V
Min
1.14
1.14
3.13
2.0
–0.5
1.74
–0.5
–40
–40
DDEXT
DDEXT
IN
B Grade
+125
+125
Max
1.26
1.26
3.47
V
+0.8
V
+1.19
2
= 1.2 V
Max
Max
DDEXT
DDEXT
2
+ 0.5
+ 0.5
Min
0.95
0.95
3.13
2.0
–0.5
1.74
–0.5
–40
–40
Min
2.4
Y Grade
Max
1.05
1.05
3.47
V
+0.8
V
+1.19
+125
+125
DDEXT
DDEXT
Max
0.4
10
10
200
10
10
200
800
10
4.7
+ 0.5
+ 0.5
Unit
V
V
μA
μA
μA
μA
μA
μA
mA
mA
pF
Unit
V
V
V
V
V
V
V
°C
°C