PIC16F684-I/SLG Microchip, PIC16F684-I/SLG Datasheet - Page 152

• Manufacturer Part Number: PIC16F684-I/SLG
• Description: pic, flash, Microcontrollers, Microprocessors, Semiconductors and Actives, ic, mcu
• Manufacturer: Microchip

PIC16F684
17.2
The following sections give the technical details of the packages.
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS41202C-page 150
Package Details
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
E1
eB
E
Dimension Limits
2
1
§
c
D
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
A
A1
MIN
Preliminary
.140
.115
.015
.300
.240
.740
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.750
.130
.012
.058
.018
.370
14
10
10
B
B1
MAX
.170
.145
.325
.260
.760
.135
.015
.070
.022
.430
15
15
MIN
18.80
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
p
5
5
MILLIMETERS
 2004 Microchip Technology Inc.
NOM
19.05
6.35
2.54
3.94
3.30
7.94
3.30
0.29
1.46
0.46
9.40
A2
14
10
10
L
MAX
19.30
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15