mpc5632m Freescale Semiconductor, Inc, mpc5632m Datasheet - Page 68

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mpc5632m

Manufacturer Part Number
mpc5632m
Description
Mpc5634m Microcontroller Data Sheet
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Electrical Characteristics
3.8
The power consumption of an I/O segment depends on the usage of the pins on a particular segment. The power consumption
is the sum of all output pin currents for a particular segment. The output pin current can be calculated from
the voltage, frequency, and load on the pin. Use linear scaling to calculate pin currents for voltage, frequency, and load
parameters that fall outside the values given in
68
7
8
9
10
11
12
13
14
15
IOH_S = {6, 11.6} mA and IOL_S = {9.2, 17.7} mA for {slow, medium} I/O with VDDEH=4.5 V;
IOH_S = {2.8, 5.4} mA and IOL_S = {4.2, 8.1} mA for {slow, medium} I/O with VDDEH=3.0 V
16
IOH_F = {12, 20, 30, 40} mA and IOL_F = {24, 40, 50, 65} mA for {00, 01,10, 11} drive mode with VDDE=3.0 V;
IOH_F = {7, 13, 18, 25} mA and IOL_F = {18, 30, 35, 50} mA for {00, 01, 10, 11} drive mode with VDDE=2.25 V;
IOH_F = {3, 7, 10, 15} mA and IOL_F = {12, 20, 27, 35} mA for {00, 01, 10, 11} drive mode with VDDE=1.62 V
17
18
19
20
21
22
23
24
25
26
V
Regulator is functional, with derated performance, with supply voltage down to 4.0 V.
Multi-voltage pads (type pad_multv_hv) cannot be below 4.5 V when in low-swing mode.
The slew rate (SRC) setting must be 0b11 when in low-swing mode.
While in low-swing mode there are no restrictions in transitioning to high-swing mode.
Pin in low-swing mode can accept a 5 V input.
Values are pending characterization.
Pin in low-swing mode can accept a 5 V input.
Characterization based capability:
All VOL/VOH values 100% tested with ± 2 mA load.
Bypass mode, system clock @ 1 MHz (using system clock divider), PLL shut down, CPU running simple executive
code, 4 x ADC conversion every 10 ms, 2 x PWM channels @ 1 kHz, all other modules stopped.
Bypass mode, system clock @ 1 MHz (using system clock divider), CPU stopped, PIT running, all other modules
stopped.
Power requirements for each I/O segment are dependent on the frequency of operation and load of the I/O pins on
a particular I/O segment, and the voltage of the I/O segment. See
for specific operation. The total power consumption of an I/O segment is the sum of the individual power
consumptions for each pin on the segment.
Absolute value of current, measured at V
Weak pull up/down inactive. Measured at V
and pad_mh.
Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately
one-half for each 8 to 12
pad_ae.
Applies to CLKOUT, external bus pins, and Nexus pins.
Applies to the FCK, SDI, SDO, and SDS pins.
This programmable option applies only to eQADC differential input channels and is used for biasing and sensor
diagnostics.
Characterization based capability:
FLASH
I/O Pad Current Specifications
is only available in the calibration package.
o
C, in the ambient temperature range of 50 to 125
Preliminary—Subject to Change Without Notice
MPC5634M Microcontroller Data Sheet, Rev. 3
Table
IL
DDE
and V
16.
= 3.6 V and V
IH
.
DDEH
Table 16
= 5.25 V. Applies to pad types: pad_fc, pad_sh,
for values to calculate power dissipation
o
C. Applies to pad types: pad_a and
Freescale Semiconductor
Table 16
based on

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