mpc5632m Freescale Semiconductor, Inc, mpc5632m Datasheet - Page 57

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mpc5632m

Manufacturer Part Number
mpc5632m
Description
Mpc5634m Microcontroller Data Sheet
Manufacturer
Freescale Semiconductor, Inc
Datasheet
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests
on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from
the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling
effects of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
USA
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
3.3
Freescale Semiconductor
1
Radiated
emissions,
electric field
EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03.
Ψ
P
C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications”, Electronic
Packaging and Production, pp. 53-58, March 1998.
B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application
in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
D
Symbol
JT
EMI (Electromagnetic Interference) Characteristics
= power dissipation in the package (W)
= thermal characterization parameter (
V
Parameter
RE_TEM
Preliminary—Subject to Change Without Notice
V
T
150 kHz - 30 MHz
RBW 9 kHz, Step
Size 5kHz
30 MHz - 1 GHz -
RBW 120 kHz, Step
Size 80 kHz
MPC5634M Microcontroller Data Sheet, Rev. 3
A
DD
= +25 °C
Table 9. EMI Testing Specifications
Conditions
= 5.5 V;
o
C/W)
No PLL frequency
16 MHz crystal
16 MHz crystal
40 MHz bus
40 MHz bus
modulation
modulation
+/-2% PLL
frequency
f
OSC
/f
BUS
150 kHz - 50 MHz
150 kHz- 50 MHz
500 - 1000 MHz
500 - 1000 MHz
150 - 500 MHz
150 - 500 MHz
50 - 150 MHz
50 - 150 MHz
Frequency
SAE Level
SAE Level
1
IEC Level
IEC Level
Electrical Characteristics
(Max)
Level
20
13
13
20
26
26
11
13
K
3
L
2
dBμV
dBμV
Unit
57

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