ANXS1750FXC3M AMD (ADVANCED MICRO DEVICES), ANXS1750FXC3M Datasheet - Page 60

• Manufacturer Part Number: ANXS1750FXC3M
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ANXS1750FXC3M

• Lead Free Status / RoHS Status: Compliant

5.9.3
The tables in this section specify the part-specific thermal power performance specifications for the Geode NX processor.
This includes the nominal DC operating voltage of the processor core in the C0 Working state and the Stop Grant state.
Note 1. See Figure Figure 3-1 "Processor Power Management States" on page 33.
Note 2. Power measurements are at 500 MHz and 1.05V.The AMD processor system bus is disconnected and has a low
Note 3. The AMD Geode™ NX 1750@14W processor operates at 1.4 GHz, the NX 1500@6W processor operates at 1.0
Note 4. Thermal design power represents the maximum sustained power dissipated while executing publicly-available soft-
60
AMD Geode™ NX 1250@6W Processor (Note 3)
AMD Geode™ NX 1500@6W Processor (Note 3)
AMD Geode™ NX 1750@14W Processor (Note 3)
Frequency in MHz
power ratio of 1/64 for Stop Grant disconnect and a low power ratio of 1/64 Halt disconnect applied to the core clock
grid of the processor.
GHz, and the NX 1250@6W processor operates at 667 MHz. Model numbers reflect performance as described
here: http://www.amd.com/connectivitysolutions/geodenxbenchmark.
ware or instruction sequences under normal system operation at nominal V
itor the temperature of the processor to prevent the processor from exceeding its maximum die temperature.
1000
1400
Part-Specific Thermal Power Performance Specifications
667
31177H
Table 5-18. Thermal Power Performance Specifications
(Core Voltage)
V
CC_CORE
1.10V
1.00V
1.25V
Working State C0
25.0W (Note 4)
(14.0W typical)
9.0W (Note 4)
(6.0W typical)
9.0W (Note 4)
(6.0W typical)
(Note 1)
Thermal Power Max
Stop Grant C3/S1
(Note 1) (Note 2)
3.0W
3.0W
3.0W
CC_CORE
AMD Geode™ NX Processors Data Book
. Thermal solutions must mon-
Electrical Specifications
Maximum Die
Temperature
95°C
95°C
95°C