MT49H32M9FM-33 IT Micron Technology Inc, MT49H32M9FM-33 IT Datasheet - Page 64

• Manufacturer Part Number: MT49H32M9FM-33 IT
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M9FM-33 IT

• Organization: 32Mx9
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 300MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 609mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Not Compliant

Figure 38:
PDF: 09005aef80a41b46/Source: 09005aef809f284b
RLDRAM_II_CIO_Core.fm - Rev. D 12/10 EN
COMMAND
ADDRESS
BANK
DK#
CK#
DM
DQ
DK
CK
WRITE
Bank a
Consecutive WRITE Bursts with Multiplexed Addressing
T0
Ax
Notes:
NOP
T1
Ay
t
RC = 4
1. Data from the second WRITE command to bank a will appear on subsequent clock cycles
2. DI a = data-in for bank a; DI b = data-in for bank b.
3. Three subsequent elements of the burst are applied following DI for each bank.
4. Each WRITE command may be to any bank; if the second WRITE is to the same bank,
that are not shown.
must be met.
288Mb: x9, x18, x36 2.5V V
Bank b
WRITE
T2
Ax
WL = 6
T3
NOP
Ay
Bank a 1
WRITE
T4
Ax
64
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T5
NOP
Ay
EXT
, 1.8V V
T6
NOP
DI
a
T6n
DD
TRANSITIONING DATA
, HSTL, CIO, RLDRAM II
T7
NOP
©2004 Micron Technology, Inc. All rights reserved.
T7n
T8
DI
NOP
b
Operations
T8n
DON’T CARE
T9
NOP
t
RC